Thermal Engineering Technical Leader

The application window is expected to close on: 09/29/2026 This role will be based out of our San Jose, CA office. Meet the Team Cisco is seeking a Thermal Engineering Technical Leader to join a dynamic team focused on developing advanced thermal solutions for high-performance networking and compute platforms. This senior individual contributor role is part of a collaborative environment that drives innovation in liquid and air cooling systems, including cold plates, CDUs, heat sinks, and vapor chambers. The team works closely with hardware design, manufacturing, and supplier engineering groups to integrate robust thermal technologies at scale, contributing to Cisco’s next-generation ASIC, optical, and power systems.

In this role, you will lead the design, simulation, validation, and production readiness of product-level thermal solutions, both liquid and air-cooled. You will own modeling, simulation, thermal testing, and performance validation workflows, partnering with suppliers, ODMs, and internal teams to evaluate and implement new cooling technologies. Your work will define design parameters, correlate physical testing with simulation models, and collaborate with Cisco hardware design teams to roadmap next-generation thermal strategies. You will also contribute to cross-functional efforts to improve qualification and specification standards, driving innovation and ensuring high-performance system design.

BS in Material Science, Mechanical, or Chemical Engineering (MS preferred) or related. 8+ years of experience in thermal/mechanical design for electronics Direct experience with liquid cooling systems: cold plates, manifolds, pumps, CDUs Strong working knowledge of air-cooled solutions: heat pipes, vapor chambers, TIMs Hands-on validation and troubleshooting with thermal data acquisition tools Proficient in CFD (Computational Fluid Dynamics) and simulation-to-test correlation Quick learner, adaptive in learning through sensing and academic research Preferred Qualifications 10+ years of experience in microelectronics thermal management Proven experience productizing liquid cooling solutions, beyond lab or R&D work Familiarity with component packaging (BGA, Flip Chip, 2.5D/3D IC) Understanding of component and system reliability for thermal subsystems Effective communicator with ability to present findings to cross-functional and executive audiences   Why Cisco?  At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint. Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere.  We are Cisco, and our power starts with you.  Message to applicants applying to work in the U.S. and/or Canada: The starting salary range posted for this position is $162,500.00 to $205,400.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits. Individual pay is determined by the candidate's hiring location, market conditions, job-related skillset, experience, qualifications, education, certifications, and/or training. The full salary range for certain locations is listed below. For locations not listed below, the recruiter can share more details about compensation for the role in your location during the hiring process.