Panel Packaging Technology Enablement Director

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

Salary: $176,000.00 - $242,000.00 Location: Austin,TX, Santa Clara,CA You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.  At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits .  Applied Materials is building the equipment, process, and integration capability that makes panel-level packaging a production-ready scaling path for AI accelerators and high-performance computing. The Director, Panel Packaging Technology Enablement leads the team that develops and validates panel process solutions, from core substrate formation through build-up and interconnect. The role combines technical leadership of panel integration programs, direct engagement with customers and ecosystem partners, and management of a multidisciplinary engineering team. The Director sets the technical direction for panel enablement within the business unit and represents Applied Materials across the substrate, OSAT, foundry, and materials ecosystem.

Technology Development and Integration Defines and executes the panel technology enablement roadmap, translating AI package architecture requirements (package size, I/O density, power delivery, warpage, and reliability) into unit process and integration targets for panel technology. Plans integrated process flows spanning core formation, through-glass via fabrication and metallization, fine-line RDL and build-up layers, and panel-scale interconnect. Leads the most complex integration programs from concept through customer transfer, including customized process development. Originates, designs, and analyzes engineering experiments within safety guidelines, using DOE and statistical methods to establish process windows and resolve root cause on multi-process integration issues. Identifies gaps in the Applied portfolio and provides direct feedback to business unit and product division leaders on process and hardware improvements needed to meet customer roadmaps. Drives coordination across product divisions so panel solutions are delivered as integrated packages rather than individual tools. Customer Engagement Serves as the primary technical lead to strategic customers on panel packaging, including substrate manufacturers, OSATs, foundries, and accelerator designers. Positions new Applied technologies, negotiates process specifications and service offerings, and owns delivery of solutions that address high-value customer problems. Establishes and oversees joint development programs, evaluations, and beta-site activities at customer development and manufacturing sites. Defines demo conditions, reviews results, and ensures learnings are captured and applied across the portfolio. Makes executive-level presentations to customer and partner leadership. Works with account teams to strengthen customer satisfaction and Applied’s technical standing in advanced packaging. Industry Collaboration and Ecosystem Development Builds and manages strategic