Quantum Compute Thin Film Stack Materials Engineer

Quantum Compute Thin Film Stack Materials Engineer Full-time Job Type (exemption status): Exempt position - Please see related compensation & benefits details below Salary Range: 184,500.00-246,000.00 Business Function: R&D Engineering Work Location: San Jose Great Oaks Headquarters--LOC_WDT_USCA23 Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time. That’s where we come in. We combine deep engineering expertise with global-scale manufacturing to deliver the storage systems that make AI possible, powering hyperscale data centers, cloud platforms, and enterprise infrastructure worldwide. This isn’t theoretical work. It’s real systems, at real scale, people solving some of the hardest challenges in technology today. We’re looking for people who want to build, solve, and operate at that level. Join us and let’s shape the future of data.

We are seeking a talented researcher to join our team and drive innovative research projects in quantum computing, specifically to focus on quantum compute materials thin film stack development. The key emphasis of the project will focus on deposition of Al, Nb and Ta based superconductors and various insulators (including AlOx) for developing a full thin film materials stack needed for high quality factor resonators and Josephson junction. The key emphasis of the project will be careful surface preparation, careful control of interfaces, grain size distribution, crystallinity and room temperature stack resistance. The overarching goal of the project is to translate exceptional process uniformity abilities in Western Digital into exceptional resonator and qubit performance uniformity across the wafer, and from wafer to wafer. In the course of the project, you will collaborate with nanofabrication scientists working on device nanofabrication, electrical characterization team focused on quantum characterization of devices and with device designers. Successful candidates are expected to have deep familiarity with superconducting qubit design, variety of thin film deposition techniques, as well as thin film characterization techniques allowing them to operate independently and at high throughput, and prior familiarity with superconducting qubit device designs and potential material systems. ESSENTIAL DUTIES AND RESPONSIBILITIES  Lead and execute research projects in quantum computing thin film materials stack design, and surface and interfaces control Lead effort in thin film materials stack characterization Collaborate with product teams to tackle novel challenges and develop innovative solutions.  Collaboration: Stay current with industry and academic trends, publishing papers and presenting at conferences.  Reporting: Develop and present detailed reports and visualizations to communicate findings, trends, and actionable insights to stakeholders at all levels. Motivation: Highly self-motivated problem solver able to thrive in unstructured environment. Ability to independently pursue fundamental research, including paper writing and publishing. Communication: Excellent written and verbal communication skills, with the ability to present complex data and insights clearly to both technical and non-technical audiences.  Analytical Skills: Demonstrated ability to quickly grasp and address challenges outside of immediate field of expertise.

Required: Ph.D degree and post-doctoral experience in Physics, Electrical Engineering, Materials Science with focus on development of various (Al, Nb, Ta) thin film materials stacks for superconducting qubits Thorough understanding of superconducting qubit design theory Experience in nanofabrication methods for superconducting qubits is a plus Experience in thin film materials characterization including XRD, AFM, CIPT,