Data Center System Interconnect Engineer

ADVANCE YOUR CAREER. ADVANCE THE WORLD.  At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.    Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career. T HE ROLE :   AMD is driving innovation in data center infrastructure, enabling next-generation AI, cloud, and high-performance computing platforms through advanced interconnect solutions. As a  Data Center System Interconnect Engineer , you will lead the design and development of high-speed connectors, cables, and sockets that form the backbone of modern server and rack-scale architectures. This role blends deep technical expertise with system-level thinking to deliver scalable, reliable, and cost-optimized interconnect solutions that power AMD’s leadership in hyperscale and enterprise environments.   THE PERSON: The ideal candidate is a hands-on, system-level interconnect engineering leader with experience developing and qualifying high-speed connectors, cables, sockets, and blind-mate interfaces for data center or other complex hardware platforms. They combine expertise in signal integrity, mechanical reliability, tolerance analysis, materials, and failure analysis with strong supplier leadership and cross-functional communication skills. They are collaborative, decisive, and energized by solving complex interconnect challenges that improve the performance, scalability, reliability, and manufacturability of AMD’s next-generation AI and high-performance computing systems. K EY RESPONSIBLITIES : Own end-to-end development of high-speed interconnect components—connectors, cables, and sockets—optimized for data center platforms and rack-scale deployments. Architect advanced interconnect solutions for emerging packaging technologies, multi-node systems, and high-density racks, influencing platform-level design decisions. Lead performance validation through signal integrity analysis, mechanical reliability testing, and compliance with industry standards for high-speed data transmission. Develop and qualify interconnect ecosystems including test boards, fixtures, and evaluation methodologies to ensure readiness for high-volume manufacturing. Manage multi-supplier programs to accelerate innovation and maintain a robust supply chain for critical interconnect technologies. Collaborate cross-functionally with packaging, board, and system teams to optimize interconnect performance across electrical, mechanical, and thermal domains. Create and maintain technical documentation including specifications, BOMs, and assembly guidelines for manufacturing and quality assurance. Drive continuous improvement by mentoring teams, fostering innovation, and advancing AMD’s interconnect technology roadmap.

Proven experience in high-speed interconnect technologies for data center systems, including blind mate connectors, cables, and sockets. Knowledgeable in optical connectors for datacenters. Expertise in mechanical tolerance analysis (RSS/Monte Carlo) and connector reliability standards. Hands-on experience with signal integrity principles, VNA measurements, and failure analysis of separable interfaces and solder joints. Familiarity with contact metallurgy, plating finishes, and root cause analysis for interconnect failures. Strong program leadership skills with experience managing supplier development and qualification. Proficiency in CAD tools (AutoCAD, SolidWorks), simulation tools (LabVIEW, MATLAB, JMP), and structural FEA is a plus. Excellent communication skills for technical documentation and executive presentations.   ACADEMIC