ASIC III - AMZ27336.4

Employer: Annapurna Labs (U.S.) Inc.

ASIC III - AMZ27336.4 Location: Austin, TX Multiple Positions Available: Engage in definition, design and validation of AWS next generation ML Chips, Cards and server integration. • Participate in the design and execution of all HBM, Memories and Serdes topics, with the goal of creating and customized platforms that fit within AWS datacenter’s world leading technology. • Work with vendors, understand the settings, write/modify tests, debug and collect data in the fleet • Participate in the code review process, design discussions, team planning, and ticket/metric/COE reviews • Collaborate with architects, design teams, software engineers to deliver the next generation ML chip. • Responsible for IP integration, 2.5D design, bring up, Characterization and validation. • Focus on operational excellence, constructively identifying problems and proposing solutions. (40 hours / week, 8:00am-5:00pm, Salary Range $202779 - $215300) Amazon.com is an Equal Opportunity – Affirmative Action Employer – Minority / Female / Disability / Veteran / Gender Identity / Sexual Orientation #0000