Ocotillo Technology Fabrication Yield Defect Metrology Module Team Leader

Job Description: This position is for the Yield Dept. Defect Metrology Layer Owner Module Team Leader in Arizona Ocotillo Technology Fabrication site. Yield MTL reports directly to Eagle Yield Department Manager. The Yield MTL will be responsible for but not limited to: The performance, development, and employee relations of engineers and technicians. The Module Team Leader will also partner with other Yield, Process Engineering, Production leaders to operate as one team to ensure consistency in results across all of their functional area. The Yield Module Team Leader also will have horizontal and vertical interaction and influence in the Ocotillo Technology Fabrication organization and must be able to lead and influence results for improved yield performance. The Module Team Leader will be responsible for the roadmap to meet goals against various metrics in safety, quality, yield improvement, training, and employee relations. The Module Team Leader will be responsible for driving and leading the factory on a key yield vector, striving for BIC performance. Module Team Leader will be a role model Ocotillo Technology Fabrication culture and for setting the standard for expectations to living the culture. The ideal candidate should exhibit the following behavioral traits: Excellent listening, written and verbal communication, high ownership, tolerance of ambiguity, and commitment to task. Skills to work in a high performing team culture which includes: setting high expectations, driving accountability to those expectations with a high sense of urgency, role modeling the desired culture, possess excellent teamwork and leadership skills, demonstrated problem solving and prioritization skills, and driving high performance maintenance goals for the group. Skills to inspire a team to achieve desired behaviors and objectives. Skills to provide direct feedback and course correct individuals or teams. Leadership skills.

Candidate must possess the below minimum qualifications to be initially considered for this position. Qualifications listed as preferred or additional will be considered a plus factor for applicants.

Candidate must possess a Bachelor Bachelor's Degree in Electrical Engineering, Microelectronics Engineering, Material Science Engineering, Chemical Engineering, Mechanical Engineering, Optical Engineering, Statistics/Data Science, Chemistry, Physics, or related field of study with 7+ years of process/yield engineering management experience in wafer fabrication. Master’s or Ph.D. degree in Bachelor's Degree in Electrical Engineering, Microelectronics Engineering, Material Science Engineering, Chemical Engineering, Mechanical Engineering, Optical Engineering, Statistics/Data Science, Chemistry, Physics, or related field of study with 5+ years of experience in process/yield engineering management experience in wafer fabrication. Depending on the degree obtained the listed years of experience will be needed in the below skill sets: Knowledge of process flow and equipment troubleshooting. Model Based Problem Solving skills. Technical expertise within Semiconductor Processing engineering to provide technical direction on quality issues. Data analysis skills.

Active US Government TS Security Clearance with SCI access OR the ability to obtain and maintain a US Government TS Security Clearance with SCI access (requires US Citizenship) Technical experience within any of the Yield groups. Previous experience as Group Leader, MTL or Area Manager, or in driving high performing technical teams to deliver results is considered a plus.            Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin,