Engineer, Senior (Technology Integration - Wafer-level Packaging)

Company: RF360 Singapore Pte., Ltd. Job Area: Engineering Group, Engineering Group > Process Development Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Process Development Engineer, you will develop new or modified products, materials, and process formulations that meet and exceed customer expectations and enable cutting-edge, world class products. Qualcomm Engineers collaborate across functions and with externals customers to enhance the application of new product technology and manufacturing. Minimum Qualifications: • Bachelor's degree in Engineering, Science, or related field and 2+ years of Product/Process Development or related work experience. OR Master's degree in Engineering, Science, or related field and 1+ year of Product/Process Development or related work experience. OR PhD in Engineering, Science, or related field. Job Scope • Responsible for end‑to‑end development, qualification, and mass‑production transfer of new processes, materials, and manufacturing technologies. • Ensure process readiness, robust manufacturability, and smooth ramp‑up through strong cross‑functional coordination, data‑driven decision‑making, and technology leadership. • Initiate and participate actively in discussions on formulation of process technology innovation and release process improvement. • Collaborate and develop effective working relationships with technology partners to accomplish project/ task goals within committed schedule. • Develop new and impactful ideas, materials, solutions, and/ or procedures for product fabrication process and technology meeting the business goals and launch schedule with competitive manufacturing costs. • Serve as technology subject matter expert applying technical knowledge and skills in own area of expertise to address moderately complex issues in manufacturing environment.

Technology Development • Lead development of new processes, modules, or integration flows from concept to qualification and manufacturing release. • Define process requirements, success criteria, design‑of‑experiments (DOE), and characterization plans. • Drive root‑cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets. • Translate product requirements into process specifications and control strategies. Technology Transfer & Ramp • Co-own the technology transfer roadmap with project leader - from pilot line to high‑volume manufacturing. Adapts to shifting priorities and resources while ensuring deadlines are met. • Supervise and provide technical guidance to onsite process transfer activities, including documentation (PFMEA, etc), training, process replication, and equipment matching. • Work with each process cluster to establish critical process windows, statistical control limits, and ramp‑readiness criteria. • Coordinate and report ramp performance tracking (yield, scrap, cycle time, tool capability) and drive closure of gaps.

Requirements Bachelor’s or Master’s degree in Engineering (Materials, Chemical, Semiconductor, etc.). • 3+ years of experience in process integration engineering, technology development, or a high volume manufacturing fab. • Broad exposure to wafer-level packaging technology and processes. • Demonstrated success leading cross disciplinary technology integration projects. • Strong skills in DOE, SPC, data analytics, FMEA, and troubleshooting. • Excellent communication, technical documentation, and stakeholder management skills. Skills, Abilities & Knowledge Resourceful with critical thinking in problem solving. • Project and priority management skills. • Experience in semiconductor, MEMS, packaging, or high‑volume