Technical Director, Advanced Packaging Integration

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

Location: Singapore,SGP You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.  At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits .  We are seeking a highly skilled Advanced Packaging Technical Director to join the Disruptive Technology Pathfinding team within Applied Materials’ Advanced Packaging division. This role focuses on advanced packaging process integration, with particular emphasis on materials and process development while ensuring seamless integration across manufacturing processes on large form factor substrates. This role leads and/or develops and executes exceptionally complex technology and engineering development projects.

Lead cross-functional efforts to develop and enable next-generation 2.xD packaging concepts, architectures, and technologies Define, document, and implement end-to-end process flows for panel-level packaging technologies Lead material selection, characterization, and compatibility assessments for large form factor substrates Partner with customers to define and align process specifications and acceptance criteria Collaborate with business units on process development (lithography, etch, thin films, etc.), module co-optimization, and technology transfer to customers Contribute to Applied’s equipment product strategy by providing feedback to business unit leaders on process and hardware enhancements required to meet customer roadmaps Analyze process data to identify trends, drive optimization, and improve performance Conduct root-cause analyses of defects and implement corrective actions to improve yield and reliability Within established safety guidelines, design and execute complex engineering experiments; collect and analyze data; and deliver rigorous reports with innovative, practical solutions Publish and present technical findings at leading industry conferences and in peer-reviewed journals Mentor and guide early-career engineers; provide technical direction and best practices Requirements Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field In-depth knowledge and hands-on experience with advanced 2.xD packaging technologies such as fan-out panel-level packaging (FOPLP), (organic) interposer, substrate and wafer-level back-end technologies and related process flows Expertise in semiconductor processing and integration, including lithography, dry etch, thin film deposition and materials modification techniques on wafer and/or panel-level Strong understanding of process equipment and packaging specific materials, including selection criteria, process interactions and performance trade-offs Proficiency in statistical data analysis (e.g. DoE, JMP) Knowledge of industry standards and best practices in semiconductor packaging Solid understanding of process characterization, metrology, materials & failure