Memory/Advanced Packaging Strategy Technologist

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

Salary: $148,000.00 - $203,500.00 Location: Gloucester,MA You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.  At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits .  Memory Technology Roadmap and Strategy supporting the Varian Business Unit of the Silicon Products Group. The Varian Business Unit is responsible for developing solutions to address customer challenges in implant, patterning, packaging and photonics applications. The incumbent will play a key role in the organization serving both internal and external customers.  This role encompasses several responsibilities including supporting the strategic planning processes for the business units, supporting market sizing, forecasting and analysis function, and constructing high-level messages and presentations for internal, corporate, and external audiences.

Understand industry technology roadmap as well as key path finding activities for next 10 years and implications to Applied  Work with a team of marketing, technical, and engineering professionals to identify key challenges for future memory technologies with focus on Memory and Advanced Packaging. Understand technology inflections in Memory technology and translate to process equipment requirements. Integrated demo and integration support to Business Units Write and file IP to protect developed integration solutions. Develop technical/ marketing collateral to promote Applied Materials solutions. Gather data, analyze customer and competitor strategies to meet inflection needs, provide updates and act as a thought partner to a variety of stake holders  Support nodal sizing, forecasting and market share analysis for the Business Units, clearly understanding the impact of upcoming technology changes and inflections and their impact to the Business Units. Analyze the technology and economic environment including monitoring end-user trends impacting market demand, identifying emerging new markets, and tracking worldwide customer investment plans, technology adoption and changes to the customer landscape Track competitors’ positions by customer/inflection segment and assist in sizing and prioritizing specific penetration opportunities Assist, as needed, in constructing executive presentations for internal and external audiences Functional Knowledge Excellent understanding of Memory technologies such as DRAM, NAND and knowledge of process integration and device physics is required. Good understanding of advanced packaging processes and integration schemes is a strong plus. At least 5 years of experience in semiconductor processing as a lead process integration engineer or device engineer working on leading edge technology. Advanced degree (M.S./ Ph.D) in Materials Science/ Electrical Engineering/ Chemical Engineering/ Physics or related fields is required. Excellent presentation skills, data analysis skills, and communication skill. Ability to work