Advanced Packaging Integration and Simulation Intern

Job Description: Intel Technology Research is advancing the future of AI and high-performance computing through innovative advanced packaging technologies and 3D heterogeneous integration. Enabling novel system architecture, developing innovating process integration and establishing predictive physics-based simulation capabilities are critical for enabling complex large form factor packages with high-bandwidth interconnect. As an Advanced Packaging Integration and Simulation Intern, you will collaborate with leading researchers, process engineers, and modeling experts to develop and assess next-generation package architectures. In this role, you will contribute to advanced Research and Dev across package integration, process flow definition and development, package modeling, yield and reliability assessment, and data analytics.

Support advanced packaging integration activities across wafer-level and package-level process flows, including wafer level process, 2.5D/3D integration, chiplet integration, and hybrid bonding-related modules. Develop and execute Design of Experiments (DOE) to understand relationships among package architecture, process conditions, material behavior, and electrical/mechanical performance. Build, calibrate, and apply simulation models to understand mechanical characteristics of packages, interconnect quality, thermal performance, etc. Conduct thermo-mechanical simulations to evaluate material responses to temperature, stress, and package-level loading conditions. Analyze inspection, process, and simulation data to identify root causes of integration challenges and recommend improvement paths. Collaborate with cross-functional teams to optimize process flows for yield, reliability, manufacturability, and package performance. Present findings through technical presentations and potential publications. What You Will Gain : Gain hands-on exposure to advanced packaging integration challenges that enable future semiconductor technologies. Learn how process integration, material selection, design rules, metrology, and package architecture interact to drive yield and reliability. Develop practical experience with developing package simulation, model validation, and data-driven engineering analysis. Gain exposure to advanced packaging architectures, including chiplets, 2.5D/3D integration, wafer-level assembly, and industrial leading interconnect technologies. Participate in technical reviews, technology forums, and intern research presentations with experienced engineers and researchers.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.

Candidate must be pursuing a   PhD degree   in Mechanical Engineering, Materials Science and Engineering, Electrical Engineering, Physics, Manufacturing Engineering, or a closely related STEM discipline Must be available to work full-time for the duration of a 3-month internship.   3+ months of academic or professional experience in one or more of the following areas: Experience with laboratory experimentation, engineering data analysis, or simulation/modeling workflows. Experience in process integration or hands-on module development. Programming or data analysis experience using Python, MATLAB, JMP, R, or similar tools. Statistical analysis, DOE, or machine learning for engineering applications.

6+ months of academic or professional experience in one or more of the following areas: Advanced packaging, heterogeneous integration, wafer-level packaging, chiplet integration, or package assembly process development.