Hardware Engineering Asc Mgr

Standard Job Description 
 Manages the research, design, development, and testing of COTS or custom computing hardware and/or otherelectrical components. Responsible for coordinating subordinate employee recruitment, selection and training, performance assessment, work assignments, salary, and recognition/disciplinary actions. Oversees the development of designs for the installation of components into chassis, racks, cabinets, and workstations, customer facilities, and/or shelters. Plans, directs, reviews and coordinates preparation of project documentation to ensure customer contract and company requirements are met. Ensures proper preparation of specifications, evaluation of vendors, and analysis of test reports. What We're Doing As a part of the Lockheed Martin community, we take on challenges and find solutions using creativity and collaboration. If you’re looking to be a part of a passionate team solving these complex problems, then Rotary and Mission Systems is the place for you. The Work This position is for the First Line Manager (FLM) of the Electronics Packaging group which is part of the Sensors mechanical Design and Test (SMDT) organization. As the FLM you will report directly to the Senior Manager of SMDT. In this role, you will: Manage the research, design, development, and testing of COTS or custom computing hardware and/or other electrical components. Be responsible for coordinating subordinate employee recruitment, selection and training, performance assessment, work assignments, salary, and recognition/disciplinary actions. Oversees the development of designs of custom and commercial off the shelf (COTS) printed wiring boards (PWB), Circuit Card assemblies (CCA), electonic modules, and other electronic enclosures along with design documentation and mechanical analysis. Plans, directs, reviews and coordinates preparation of project documentation to ensure customer contract and company requirements are met. Ensures proper preparation of specifications, evaluation of vendors, and analysis of test reports. • Provide technical, programmatic, and administrative leadership to a group of approximately 20 engineers of varying experience levels. • Ensure the successful implementation of hardware development processes into designs for multiple programs; coordination with programs, manufacturing and subject matter experts for the development of designs and manufacturing efforts; recommendations, planning and execution of IRAD efforts; supporting business pursuits and proposals; and developing key expertise needed to grow the business in this area. • Oversee the design, development, documentation, and testing of radar hardware in the electronics packaging area. • Lead and ensure that the appropriate standards, processes, procedures are followed throughout the hardware development life cycle. • Coordinate direct report employee recruitment, training, performance assessment, work assignments, staffing, salary, recognition, and disciplinary actions for the group. • Perform gap analysis, assist in developing technology roadmaps, including electronics packaging. Basic Qualifications 
 • Bachelor’s degree in Mechanical Engineering or related field • Expertise in electronics packaging design with a minimum of 7 years of relevant professional experience • Background knowledge of electronic packaging techniques, materials, processes, documentation and analyses • Demonstrated competence in leading cross disciplinary engineering teams and must have a strong understanding of hardware engineering processes and the hardware engineering product life cycle • Demonstrated proficiencies in earned value, schedule, cost, and risk management techniques • Demonstrated ability to manage complex technical systems, programs and IRAD projects • Occasional travel is required, must be willing to travel • Ability to obtain and maintain a security clearance at the SECRET level Desired Skills 
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