Staff Engineer, HBM Test Vehicle Design

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Design Technology Package Co-Optimization (DTPCO) organization is seeking a Staff Engineer! Lead the design and development of test vehicles that enable technology learning and risk reduction for future HBM products! This role serves as a key technical contributor within DTPCO, partnering closely with Architecture, Design, Layout, Product Engineering, Reliability, and Advanced Packaging teams to translate emerging product requirements and technology challenges into actionable test vehicle solutions. You will apply expertise in semiconductor design, physical implementation, silicon characterization, and advanced packaging technologies to define test structures, develop validation strategies, and generate data that drives product decisions across future HBM generations. Unlike a traditional product role centered on ownership of product blocks, this position emphasizes enabling learning in development and engineering. It does so by developing representative test vehicles and characterization structures.

Serve as a technical lead for HBM test vehicle design and structure development within DTPCO. Partner with HBM product, technology and reliability team. Define and implement test structures targeting key learning areas such as package interaction and reliability Drive test vehicle content definition, structure specifications, measurement requirements, and validation objectives. Analyze silicon characterization and qualification results to identify optimization opportunities and communicate actionable recommendations to Design, Product, and Technology Development teams. Support development of product-enveloping experimental vehicles that improve learning and enable reuse across multiple HBM programs. Lead technical investigations to understand design, process, and package interactions impacting product performance, reliability, and manufacturability. Participate in multi-functional reviews and provide technical recommendations to guide future test vehicle content and priorities. Contribute to development of design guidelines, protocols, and lessons learned that improve future product and technology development.

Master’s degree or PhD in Electrical Engineering, Computer Engineering, Materials Science, Physics, or related field. 5+ years of semiconductor experience in design, product engineering, packaging, technology development, or related subject areas. Strong understanding of semiconductor design and physical implementation fundamentals. Experience with silicon validation, characterization, data analysis, or failure investigation. Proven ability to work effectively across multiple engineering organizations. Proficiency with demonstrating AI and AI-enabled development workflows.

Experience with HBM, DRAM, or advanced memory products. Experience designing test structures, test chips, characterization vehicles, or technology demonstrators. Knowledge of advanced packaging technologies including TSVs, hybrid bonding, and 3D integration. Understanding of reliability qualification methodologies and failure mechanisms. Experience using silicon learning to influence future design or technology decisions. Strong written and verbal communication skills with the ability to present technical findings to diverse engineering audiences. Why This Role Matters Test vehicles are a critical mechanism for identifying technology, design, and integration risks before they impact product development. This role enables Micron to generate actionable learning earlier in the development cycle, improving design quality, reducing program risk, and accelerating innovation across