Advanced Packaging Internship Program

Job Description: As a Module Engineering Undergraduate Intern, you will gain hands-on experience and work closely with engineers to support manufacturing operations also contribute to projects that improve equipment performance, process control, and production efficiency. Your contributions will directly impact production goals and drive improvements in manufacturing methodologies, offering a unique opportunity to expand your technical expertise while exploring future career prospects in a collaborative environment.

Support equipment troubleshooting, maintenance, qualification, and improvement activities. Assist in process optimization and continuous improvement projects. Collect, analyse, and interpret manufacturing data to support engineering decisions. Conduct technical research, literature reviews, and assessments. Support Design of Experiments (DOE), data analysis, and validation activities. Assist in laboratory experiments and process evaluations. Prepare technical reports, presentations, and documentation. Collaborate with cross-functional teams to achieve manufacturing and engineering objectives.

This internship opportunity is specifically designed for undergraduate students that required to undergo a compulsory industrial training/internship placement to satisfy academic requirements.

Currently pursuing a Bachelor's Degree in Electrical & Electronic Engineering, or related engineering disciplines. Good interpersonal, written, and verbal communication skills in English. Strong analytical and problem-solving skills. Able to work independently and in a team environment. Basic knowledge of semiconductor manufacturing, process engineering, or equipment engineering. Proficient in Microsoft Office applications (Excel, PowerPoint, and Word); familiarity with programming, database management (e.g., SQL), data analytics tools, or engineering software is an added advantage. Eager to learn and adapt in a fast-paced manufacturing environment. Able to commit to a minimum internship period of 3 to 6 months , subject to university/college internship requirements and academic calendar.            Job Type: Student / Intern Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Kulim Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.