Senior Design Engineer, HBM

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a   Sr   Design Engineer, you will   work on   design, simulation, and validation of   next ‑ generation   High ‑ Bandwidth   Memory (HBM) architectures and circuit blocks. HBM   requires   advanced DRAM design knowledge combined with deep understanding of 3D stacked architecture, TSV signaling, wide I/O interfaces, PHY timing, power integrity, and system   co ‑ optimization   with GPUs/accelerators.   This role sits at the intersection of DRAM design and   high ‑ performance   computing, enabling future AI/ML, HPC, and advanced graphics products.     In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction.     Responsibilities will include, but are not limited to:   Design,   optimize , and   val Support   post ‑ silicon bring ‑ up, failure analysis, and design correlation when   required   Work closely with layout engineers on   floorplanning , placement, routing, and design rule compliance    Review   parasitics , EM/IR, and reliability results; drive design or layout fixes as needed    Ensure designs are manufacturable and meet foundry and packaging     Minimum Qualifications:   Prior experience in HBM, DRAM, high ‑ speed I/O, or memory ‑ related designs    Familiarity   wiconstraints   Apply AI/ML-   nabled   tools that enhance productivity, design quality, verification coverage, and time-to-market     th   3D ‑ stacked architectures, TSVs, wide I/O interfaces, or PHY ‑ adjacent logic   Understanding of DRAM array control and   high speed   circuit design   Experience in function verification and timing analysis with mixed signal design.   Familiar with device reliability. Experienced in reliability mitigation technology and verification flow.   Familiar with analog/digital simulation tools, i.e., HSPICE,   VerilogHDL ,   Primesim ’   MS in Computer Engineering or related field   3   years   DRAM Design or Verification experience.   Excellent Problem ‑ Solving & Analytical Skills   idate   memory, logic, analog, or   mixed ‑ signal   circuits used in HBM products, including   PHY ‑ adjacent   or subsystem logic   Contribute to HBM architecture definition,   block ‑ level   specifications, and design tradeoff analysis across performance, power, area, and reliability    Perform   pre ‑ layout   and   post ‑ layout   simulation, modeling, and analysis to ensure robust design margins    Support   tape ‑ out   activities, ECOs, and reticle experiments as   required   Participate in functional, timing, and power verification using   industry ‑ standard   simulation tools    Collaborate closely with Design Verification teams to review test plans, debug failures, and close coverage gaps    (LLM) As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a