ElectroMechanical Design Engineer Sr: MicroElectronics

Standard Job Description 
 You will be the ElectroMechanical Design Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts, integrating thin film, semiconductor and high performance thermal management technologies to create next generation electronic systems for aerospace and defense missions.

As the ElectroMechanical Design Engineer you will design, prototype and test cutting edge packaging solutions while collaborating with electrical, systems, test and product design engineers. You will work side by side with Lockheed Martin’s senior Advanced Packaging SME, gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware. Your responsibilities will include: • Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets. • Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features. • Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes. • Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback. • Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports. • Collaborating with cross functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems. • Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance. • Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption. • Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts. Why Join Us Do you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you. We offer flexible work schedules to comprehensive benefits investing in your future and security, Learn more about Lockheed Martin’s comprehensive benefits package here. Further Information About This Opportunity: This position is in Orlando or Grand Prairie. Discover more about our Orlando, Florida location. Discover more about our Dallas, Texas location. MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a secret clearance. Applies electrical, electronic and mechanical principles to components and systems, including assembly, analysis, and documentation of results; construction of developmental assemblies, sub-assemblies and components; and quality testing. Supports and participates in the design, test, modification, fabrication and assembly of prototype electromechanical systems. Basic Qualifications 
 DoD Secret level clearance or be able to obtain one. Working knowledge of CREO and Windchill Geometric Dimensioning and Tolerancing, and tolerance stack-up analysis Packaging design experience Hardware design experience MUST BE A U.S. CITIZEN Desired Skills 
 Experience with Zuken E3 and Mentor CCA design and development IDX File transfer Flex design Cable and harness design Micro Electronics experience. Pay Information Full-Time Salary Range: $85300.00 - $158300.00 At  Lockheed Martin, we know mission success starts with taking care of our people. Our Total Rewards program is designed to attract top talent, support your