Manufacturing Quality Engineer

As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact. Ciena is seeking a hands-on Manufacturing Quality Engineer to lead new product introduction (NPI), process development, product transfer, and manufacturing readiness activities for semiconductor package assembly and high-reliability electronic products. This role will be responsible for driving manufacturing quality, process validation, yield improvement, and operational readiness across internal manufacturing teams and external manufacturing partners. The successful candidate will leverage expertise in semiconductor packaging, SMT, flip-chip assembly, die attach, wire bond, BGA characterization, and quality engineering to ensure successful product launches, robust manufacturing processes, and exceptional product quality. How You Will Make an Impact: Lead new product introduction (NPI) activities from product transfer through process qualification, validation, manufacturing readiness, and production release. Develop, qualify, and optimize semiconductor package assembly processes, including SMT, die attach, wire bond, flip-chip, dispensing, underfill, and backend assembly operations. Drive BGA characterization activities, including stencil optimization, reflow profiling, Design of Experiments (DOE), BGA rework qualification, and assembly process validation. Establish and maintain PFMEA, Control Plans, Process Flow Diagrams, work instructions, quality plans, and manufacturing process documentation. Define process controls, SPC monitoring requirements, process capability targets, and Critical-to-Quality (CTQ) characteristics. Lead root cause investigations and corrective actions utilizing methodologies such as 8D, DMAIC, DOE, 5-Why, and statistical analysis tools. Support failure analysis activities using AXI, CT scan, cross-sectioning, EDX, dye-and-pry, and other analytical techniques. Drive yield improvement, defect reduction, process optimization, and continuous improvement initiatives across manufacturing operations. Manage non-conforming materials, containment activities, MRB reviews, corrective actions, and preventive action programs. Support supplier quality activities, manufacturing partner audits, process qualifications, and customer quality requirements. Serve as the primary technical interface for manufacturing readiness reviews, process-related issues, and customer quality escalations. Conduct DFM/DFX reviews and identify manufacturing risks to improve quality, yield, manufacturability, and operational efficiency. The Must Haves:

Bachelor's degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Manufacturing Engineering, Materials Engineering, or a related discipline.

Hands-on experience supporting semiconductor package assembly processes, including flip-chip assembly, dam-and-fill, die attach, and wire bond technologies. Strong experience with NPI, product transfer, process qualification, validation, and manufacturing readiness activities. Experience with SMT assembly, BGA processes, reflow profiling, dispensing, underfill processes, and manufacturing process controls. Knowledge of PFMEA, Control Plans, SPC, MSA, DOE, process capability studies, and yield improvement methodologies. Strong analytical, problem-solving, communication, and technical documentation skills. Demonstrated ability to collaborate effectively with engineering, manufacturing, suppliers, customers, and contract manufacturing partners. Experience managing manufacturing quality and process-related issues in a high-technology manufacturing environment.

Experience supporting advanced packaging