Electro Mechanical Engineer Level 2

Standard Job Description 
 The Fleet Ballistic Missile Avionics team is seeking an experienced Electronics Packaging Engineer who will work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and ultimately advance them for flight use. You will support Electronic Package Enclosure design and will provide technical data for informal and formal design review documentation and presentations. You will coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. You will support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems. You will establish specifications for contract assemblers and raw-material vendors. You will interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance. Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment. You will prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed. As an Electro Mechanical Engineer, you will work on the development of a sophisticated state-of-the-art Avionics product in a world class Integrated Product Development environment.   The information below reflects the standard job description for this position: Applies electrical, electronic and mechanical principles to components and systems, including assembly, analysis, and documentation of results; construction of developmental assemblies, sub-assemblies and components; and quality testing. Supports and participates in the design, test, modification, fabrication and assembly of prototype electromechanical systems. Basic Qualifications 
 •    Bachelor of Science or higher from an accredited college in Mechanical or Aerospace Engineering or related discipline, or equivalent experience/combined education. •    Experience with CAD modeling and drafting experience (CREO, SolidWorks and/or similar CAD data modeling experience, model based engineering) •    Willing and able to obtain and maintain a DoD Secret clearance, thus US Citizenship is required Desired Skills 
 •    Avionics Design Experience  •    Package Enclosure Design •    ECAD Experience  •    Antenna Panel Design Experience •    Working knowledge EPDM tools or equivalent •    Exposure to DFx Principles (Design for Affordability, Design for Manufacturability, etc.) •    Experience with 3D printing/prototyping •    Experience with CREO CAD modeling and Zuken •    Missile/Aerospace related experience •    Proficiency in Microsoft Office Software (Word, Excel, MS Project, PowerPoint) •    Familiarity with FBM specifications/procedures •    Familiarity and experience partnering with SP/SPF Customer Partners •    Experience with QNotes (SAP/ERP), PMP Database, FAST Items, DaSI, and FBM Web (Livelink)  •    Previous CPE and MRB experience •    Ability to communicate issues and additional resource needs to leadership •    Experience with subcontracted hardware suppliers •    Experience performing tolerance stack-up •    Demonstrated ability to collaborate effectively within a team environment and with adjacent disciplines •    Excellent communication, presentation and interpersonal skills with technical and non-technical audiences including design reviews (SRR, PDR, CDR, etc.) •    Hands-on hardware experience •    Proficient in AI prompting as it applies to this position and practice Pay Information Full-Time Salary Range: $79300.00 - $147300.00 At Lockheed Martin, we know mission success starts with taking care of our people. Our Total Rewards program is designed to attract top talent, support your well-being, and help you grow—both professionally and personally. The salary range for this position is as listed on