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Senior Density Fill Development Engineer

Intel

US Oregon HillsboroSeniorH-1B sponsor company
Sign in to applyVerified 52m ago
Location
US Oregon Hillsboro
Work model
On-Site
Level
Senior
H-1B history
1,112 approvals (FY2023)
Posted
Aug 17, 2026

Skills

Linux

About this role

Job Details

Job Description: The Role and Impact Join Intel's Design Technology Platform (DTP) organization and become an integral part of a highly skilled team driving the development of cutting-edge technologies. As an EDA Tools Software Engineer, you will design, develop, test, and debug software tools and methodologies that directly support Intel's hardware product design and manufacturing processes. Your work will enable design teams to innovate faster, meet complex manufacturability constraints, and deliver industry-leading products to market. By contributing to Intel's advanced process technologies, you will play a pivotal role in achieving leadership in design automation and fostering a culture of innovation.

Key Responsibilities

Design, develop, and debug Fill components of Process Design Kits (PDKs), Provide algorithmic solutions using tools such as Calibre, ICV, and Pegasus to address density deficiencies and ensure manufacturability compliance. Collaborate with process developers, design rule owners, and end users to define requirements and implement state-of-the-art solutions. Automate workflows to enhance efficiency, accuracy, and deployment across design teams. Develop comprehensive test cases and systems to validate software tools and ensure seamless integration with various design methodologies. Innovate and drive advancements in EDA tools and methodologies to meet the evolving needs of Intel's technology ecosystem. Partner with cross-functional teams and external EDA vendors to define and implement new tool features and methodologies. Maintain documentation, including training materials and user guides, to support customers and ensure robust deployment. In this role, you will have a unique opportunity to make a lasting impact by enabling Intel's success in the competitive semiconductor landscape. Take the next step in your career and join a team where your expertise will help shape the future of technology innovation.

Qualifications

Minimum Qualifications Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field with 8+ years of experience, Master's degree with 5+ years of experience, or PhD with 2+ years of experience. Minimum 5 years of hands-on experience with at least one industry-standard physical verification platform (Calibre, ICV, or Pegasus), including methodology development, rule deck debugging, or production deployment.  3+ years of direct experience developing, maintaining, or debugging physical verification rule decks using SVRF, TVF, PXL, or PVL/PVTCL for DRC, density, or fill verification applications. Solid understanding of semiconductor device physics, process technology, and design rules. Experience in developing algorithmic solutions for physical design challenges in advanced manufacturing nodes.    Strong knowledge of Unix/Linux platforms and computing environments.

Preferred Qualifications

5+ years of hands-on experience developing, deploying, or supporting density fill methodologies for semiconductor technologies at 16nm and below, including ownership of fill rule implementation, density compliance, or manufacturability optimization. Experience with advanced physical verification techniques, including DRC, and density/fill modules.   Industry experience with other foundry technologies in this domain is strongly desirable Familiarity with custom layout tools such as Cadence Virtuoso or Synopsys Custom Designer.   Deep understanding of technology scaling challenges and their impact on physical design rules.    Proven track record of collaborating across multiple internal and external teams to deliver optimal solutions. Exceptional analytical and problem-solving skills with the ability to address cross-disciplinary challenges. Strong written and verbal communication skills, with the ability to present complex technical concepts clearly. Leadership experience driving innovation, process improvements, or cross-functional initiatives.

Listing verified 52m ago. Applications go through the company's official careers site.

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Senior Density Fill Development Engineer at Intel, US Oregon Hillsboro | Yoinka