Module Engineering PhD Intern 2027

Job Description: As a Module Engineering Intern within Intel's F25 Metals organization, you will work alongside engineers, technicians, and operations teams to support High Volume Manufacturing (HVM) of Intel's leading-edge semiconductor technologies. This role offers a unique opportunity to gain hands-on experience in semiconductor manufacturing while contributing to real-world engineering and operational challenges.   Interns will own and execute a meaningful project focused on areas such as process improvement, manufacturing efficiency, equipment performance, automation, data analytics, quality systems, or operational excellence. In addition to their primary project, interns will   participate   in day-to-day engineering activities and engage with cross-functional stakeholders to gain a broad understanding of semiconductor manufacturing operations.   Throughout the internship, you will learn how engineering decisions are made in a high-volume manufacturing environment by   observing   manufacturing workflows, analyzing data,   identifying   improvement opportunities, and communicating recommendations to technical and business partners. Interns are encouraged to explore multiple aspects of the organization through networking, mentorship, training, and collaboration across engineering disciplines.   This internship provides opportunities to:   Lead a project from problem definition through execution and final presentation   Analyze manufacturing, equipment, and operational data to support decision making   Apply structured problem-solving and continuous improvement methodologies   Collaborate with engineers, technicians, quality teams, and operational stakeholders   Develop technical communication and presentation skills   Gain exposure to advanced semiconductor manufacturing technologies and operations   Successful candidates will   demonstrate   curiosity, initiative, strong problem-solving abilities, and a desire to learn in a fast-paced manufacturing environment. This role is designed to provide meaningful industry experience while helping evaluate potential future engineers for full-time opportunities within Intel.

Minimum Qualifications   Qualifications are typically obtained through a combination of academic coursework, research experience, internships, and/or relevant industry experience.   Currently pursuing a PhD degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related technical discipline.   Minimum   GPA of 3.0.   Academic coursework or research experience in semiconductor processing, materials science, microelectronics, advanced materials, or a closely related field.   Availability to   participate   in a minimum 10 to 12-week summer internship.   3+ months of educational, research, laboratory, internship, or industry experience. Ability to work onsite in Hillsboro, Oregon.

Previous   internship, research, laboratory, project, or industry experience in engineering, manufacturing, data analytics, process development, or a related technical field.   Familiarity with semiconductor manufacturing, industrial operations, quality systems, continuous improvement, or complex technical environments.   Experience working with data analysis and visualization tools such as Python, JMP, MATLAB, Power BI, Excel, SQL, or similar platforms.   Knowledge of problem-solving and continuous improvement methodologies such as root cause analysis, 8D, SPC, Pareto analysis, Design of Experiments (DOE), Lean, or Six Sigma.   Demonstrated ability to analyze data,   identify   trends, and develop data-driven recommendations.   Experience breaking down complex problems into executable plans and managing multiple priorities simultaneously.   Experience collaborating on cross-functional projects involving technical and non-technical stakeholders.   Strong written, verbal, and presentation skills,