Package Manufacture Engineer, Senior to Staff Level (Taichung or Kaohsiung)

Company: Qualcomm Semiconductor Limited Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary:

Exhibit skill and confidence in working cross-functionally across a matrix organization in a very dynamic and fast-paced environment Support development of products and advanced technologies for Qualcomm bumping, WLP, Flip Chip CSP& BGA , SiP module, EMIB, CoWoS, CPO, Data center, ASIC, SIP, Server, Rack, and 2.5/3D Chiplet applications Support product material and design selections, technical risk assessments, mitigation plans, and development from concept to production Candidate will develop a strong understanding of substrate and assembly process details, SPC, Control plans, OCAPs, FMEAs, PCN, CARs Candidate will work cross-functionally with Design, Device process development, internal and subcontract Packaging groups Minimum Qualifications 10+ years of relevant work experience in Semiconductor (Packaging) Engineering or Manufacturing Deep understanding of packaging requirements, process capability and equipment capability throughout the industry and the ability to incorporate best engineering practices for all backend assembly process included automotive products requirements Familiar with excel, JMP data analysis tool Basic knowledge of excel VBA, Tableau software Good understanding of Chip level and package level reliability and failure analysis methodology Understand yield management, continuous improvement, assembly cycle time analysis and cost reduction Fluent in English and Mandarin, both spoken and written Proactive working attitude and capable to handle new challenge Preferred Qualifications Good knowledge of quality concept and RMA process Basic knowledge of foundry process Good understanding of wafer bumping, laser grooving, wafer saw, Pick and place, underfill and Heat spread processes Good experience with yield management software (O+), JMP analysis tool Understand assembly and test house working model, turnkey model, supply chain and KPI Education Requirements Preferred Master's degree in Electrical Engineering, Physics, Materials Science, or related discipline; Good Bachelor candidate with wide spectrum may be considered as well. Minimum Qualifications: • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  disability-accomodations@qualcomm.com  or call Qualcomm's toll-free number found  here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies :   Our Careers Site is only for individuals seeking a job at Qualcomm.