Heteregenous Integration IE Engineer

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a HIG IE Engineer, your responsibilities encompass tactical execution and planning to support tactical pillar, CAPEX and OCAP budget management, material planning for wafer probe C1-C4 to Micron IQP, build Business Processes to enable wafer level activities. Also to work as a window for wafer PRIME, pWLR and DOE material acquisition, drive sample deliveries to execution for Wafer Reliability and IQP Reliability. You are also expected to understand procurement of items, inventory logistic management, audits, continual improvements, 6S housekeeping, and project management.  It is a must for a HIG PSE IE Engineer to be familiar with Claude Code, AI apps and leveraging AI for work productivity and quality improvements.   Responsibilities include, but are not limited to:   Able to utilize Claude Code and AI apps in regular work. Proven creation of Claude Code apps (Advantageous with more than one creation) Have clear knowledge of HBM wafer probe operations starting from Assembly to post C4. Have clear knowledge of wafer material acquisition from FE processes. Liaison with NPO, SIC, NPI teams from F15 and OMT. Have knowledge in MES/MAM attributes, tagging of lots from AAA, DAA and NAA lots. Familiar with CBG setting to ensure engineering wafers are not mixed with MFG wafers. Able to track E2E DOEs requests from start to CRD/MAD. Work closely with requestors on process needs. Able to work as a team with fellow members in a safe, cohesive, and collaborative way.  Always think, converse and behave in a positive manner with a growth mindset.  Able to readily share knowledge, willing to co-work and behave professionally even under stress.  Be resourceful and able to look for solution with minimum supervision.  Able to hold your own, carry out due diligence before making decision. Escalate issue if required.  Able to resolve moderate to complex issue with minimum supervision.  Able to plan and organize work schedule, hold effective meeting to arrive at meeting intent.  Able to provide effective update by devising presentations and messages for reporting to management.  Able to perform as a lead, and mentor junior member(s) (A plus if possesses this ability)   Able to understand and support budget activity (capital, operational capital, expense) (A plus if possesses this ability)  Able to articulate onsite audits, preparation for audits and provide follow up to audit outcome.  Able to drive safety culture among the fellow team members. Be a safety role model when applicable. Follow safety procedures and rules at workplace.  Able to understand effective ESD regime in support of wafer -level activities.  Able to understand and know how to extract data for report purposes.  Able to follow up on issues and drive to closure.  Ensure document integrity and compliance with internal and external procedures.  Able to identify and promote process/equipment Improvements Possesses clear understanding of wafer probe & fabrication and test process in the semiconductor industry.  Experience in a manufacturing environment is advantageous.   HIG team member should do him/ her best to demonstrate Micron values in his/ her job performance.  People: We care about each other  Innovation: We develop solutions that shape the world’s future  Tenacity: Nothing shales our resolve  Collaboration: We work as one team  Customer Focus: We win by knowing our customers  Requirements:  Degree in Engineering with 3+ years of working experience in an engineering organization.  Ability to work flexibly in a team, supporting different functions during shortage of manpower.  Willingness to work overtime when required.  About Micron