Tech Lead, Digital Design Engineer
- Location
- San Jose, CA
- Work model
- On-Site
- Level
- Senior
- Salary
- $175.5k – $195k/yr
- H-1B history
- 10 approvals (FY2023)
- Posted
Skills
About this role
Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.
Role Overview
Astera Labs is seeking a Tech Lead Engineer to drive front-end digital design for high-performance switch ASICs that enable rack-scale AI infrastructure. In CCE2, you will translate microarchitecture into robust RTL and lead block-level execution across synthesis, timing, verification, DFT, and physical implementation.
This is an opportunity to own critical connectivity technology from architecture through GDS while partnering across design, verification, physical design, and systems teams. You will help advance scalable fabric solutions built around UALink, UCI, PCIe Gen 6/7, ESUN, and Ethernet as Astera Labs continues to deliver purpose-built connectivity for demanding AI workloads.
Key Responsibilities
• Digital Architecture and RTL Design
• Define microarchitecture and implement synthesizable RTL for complex switch ASIC blocks.
• Develop front-end design solutions for high-performance networking and server connectivity applications.
• Integrate and configure reusable IP while ensuring clean interfaces, performance, and maintainability.
• Design Implementation and Signoff
• Drive block-level execution through synthesis, timing closure, gate-level simulation, DFT, and GDS delivery.
• Analyze design tradeoffs across performance, power, area, and schedule, and resolve implementation issues with cross-functional partners.
• Apply Synopsys and/or Cadence digital design flows to deliver production-quality silicon.
• Verification, Bring-Up, and Technical Leadership
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