Quantum Compute Wafer and Device Characterization Engineer

Quantum Compute Wafer and Device Characterization Engineer Full-time Job Type (exemption status): Exempt position - Please see related compensation & benefits details below Salary Range: 157,700.00-210,300.00 Business Function: R&D Engineering Work Location: San Jose Great Oaks Headquarters--LOC_WDT_USCA23 Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time. That’s where we come in. We combine deep engineering expertise with global-scale manufacturing to deliver the storage systems that make AI possible, powering hyperscale data centers, cloud platforms, and enterprise infrastructure worldwide. This isn’t theoretical work. It’s real systems, at real scale, people solving some of the hardest challenges in technology today. We’re looking for people who want to build, solve, and operate at that level. Join us and let’s shape the future of data.

We are seeking a talented researcher to join our team and drive innovative research projects in quantum computing, specifically to focus on quantum compute wafer level characterization. The key emphasis of this role will be detailed surface, interfaces and thin film materials characterization required for the superconducting qubit nanofabrication project, across a wide spectrum of superconducting materials and various insulating films. The overarching goal of the project is to translate exceptional process uniformity abilities in Western Digital into exceptional resonator and qubit performance uniformity across the wafer, and from wafer to wafer. In the course of the project, you will collaborate with nanofabrication scientists working on device nanofabrication, electrical characterization team focused on quantum characterization of devices, device designers and thin film deposition experts. Successful candidates are expected to have deep familiarity with variety of thin film characterization techniques allowing them to operate independently and with high throughput, as well as prior familiarity with superconducting qubit device designs and potential material systems. ESSENTIAL DUTIES AND RESPONSIBILITIES  Lead and execute research projects in quantum computing wafer and device level characterization, collaborating with other team members and utilizing internal and external characterization techniques and resources Lead effort in thin film materials stack characterization and resonator and qubit device room temperature characterization utilizing various surface and interface characterization techniques Collaborate with product teams to tackle novel challenges and develop innovative solutions.  Collaboration: Stay current with industry and academic trends, publishing papers and presenting at conferences.  Reporting: Develop and present detailed reports and visualizations to communicate findings, trends, and actionable insights to stakeholders at all levels. Motivation: Highly self-motivated problem solver able to thrive in unstructured environment. Ability to independently pursue fundamental research, including paper writing and publishing. Communication: Excellent written and verbal communication skills, with the ability to present complex data and insights clearly to both technical and non-technical audiences.  Analytical Skills: Demonstrated ability to quickly grasp and address challenges outside of immediate field of expertise.

Required: Ph.D degree and post-doctoral experience in Physics, Electrical Engineering, Materials Science with focus on thin film characterization, as well as surface and interfaces characterization of thin film materials stacks for superconducting qubits Thorough understanding of superconducting qubit design Experience in nanofabrication methods for superconducting qubits is a plus Experience in thin film materials