Principal Engineer
Infineon Technologies
- Location
- Melaka
- Work model
- On-Site
- Level
- Principal
- Posted
- 3d ago
About this role
#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow's technology. As a Principal Engineer , you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?
Your role
Key responsibilities in your new role In this role, you will lead the development, optimization, and qualification of manufacturing processes , ensuring projects achieve quality, cost competitiveness, manufacturability, and timeline objectives while supporting new product introductions and emerging technology requirements. You will provide technical leadership in process innovation, complex problem-solving, supplier collaboration, knowledge transfer, and cross-functional project execution , serving as a subject matter expert to drive process excellence and technology advancement across the organization. Perform Process development activities (Process parameters scouting, optimization, verification and Process Freeze) in Development projects to meet the project targets in term of timeline, quality, cost competitiveness and manufacturability Responsible or support for technical handshake and knowledge transfer to Operations Generate and update relevant documents, (e.g. Process Specification ,PFMEA, DFMEA, Master FMEA, OJTI, T32, PDR ) Support prototype and development samples build Provide inputs for updating of related documents and is responsible for their correct contents, (e.g. Process of Record, Assembly Design Rule, Process Roadmap, Failure catalogue, Control Plan, Maintenance checklist, Unit process roadmap ) for development projects Liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in Development projects Be the technical lead for task force and complex problem-solving team using Statistical and analytical tools, (e.g. SPC, APC, DOE, 8D, FMEA, DFMEA , etc.) Identify and develop new Process technolog y and improve Process capability to meet new requirements from Business divisions Support the definition of Process technology, material, machine and tooling Provide technical guidance/buddy to other engineers and project team Initiating, generating and drive IP ideas based on reading and research Keep abreast with emerging technology to lead the definition and direction of Process technology, material, machine and tooling Can be consultant of the area of knowledge (AoK) within sites and IFX globally Be the multiplier of the AoK in technical ladder (TL) community Lead technical critical paths for the DEV related projects and AoK attention within sites Your profile Qualifications and skills to help you succeed You strive to leverage deep expertise in dispensing and jetting technologies, underfill and adhesive processes, and advanced packaging applications to drive process development, industrialization, yield improvement, and manufacturing excellence. You demonstrate strong technical leadership, analytical thinking, and data-driven problem-solving capabilities, utilizing process control, DOE, material science, automation, and Industry 4.0 principles to deliver innovative and scalable manufacturing solutions. Masters/Bachelor's Degree in Engineering or relevant course with 12 years of experience in semiconductor, advanced packaging, or SMT manufacturing or >5 years in related dispensing and jetting process professional Strong hands-on experience in Dispense and jetting technologies , Underfill and adhesive processes , Fine-pitch / high-density applications Proven track record in Process development and industrialization , Yield improvement and defect reduction , Cross-functional technical leadership, Statistical data analysis including design of experiment Understanding of below, an added advantage including: Fluid dynamics and rheology, Material science (adhesives, solder paste,