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Module Engineering PhD Intern New 2027

Intel

US, Oregon, HillsboroInternshipInternH-1B sponsor company
Sign in to applyVerified 19m ago
Location
US, Oregon, Hillsboro
Employment
Internship
Work model
On-Site
Level
Intern
H-1B history
1,112 approvals (FY2023)
Posted
Sep 11, 2026

About this role

Job Details

Job Description: As one of the world's largest chip manufacturers, and a global leader in innovative technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world-class Supply Chain and facilities support. Join us at Intel Foundry Logic Technology Development (LTD) for a Graduate internship and participate in creating the next generation of technologies that will shape the future for decades to come. LTD intern would conduct scientific research to enable manufacturing of innovative device architectures. They would engage in designing, executing and analyzing experiments necessary to meet engineering specifications for their process, and participate in process and equipment development. The Role and Impact In this role, you will contribute to module process development, process integration flows, and equipment configuration for manufacturing modules.  Work may also include support for yield improvement initiatives by analyzing defect data, conducting experiments, and assisting in risk assessments. You will work in collaboration with engineering teams to optimize metrology strategies, troubleshoot process flow issues, and continuously improve the process in preparation for high-volume manufacturing environment. As an intern, you will have an opportunity to learn and apply your knowledge, build skills, and explore future career opportunities through hands-on experience and projects that support Intel business goals in a collaborative environment. Business group As part of Intel Foundry, you will join Logic Technology Development (LTD) Metals team that focuses on Metals Thin Films Deposition within semiconductor manufacturing. The Logic Technology Development (LTD) organization delivers the latest process technology innovations to drive Intel's product roadmap. We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. The team supports Intel's broader mission of driving innovation and delivering high-quality solutions to meet global technological demands.

Key Responsibilities

Contribute to process development, continuous improvement, and implementation of semiconductor manufacturing processes for a specific module within LTD Metals. to help develop and improve our processes Design, execute, analyze experiments and present conclusions and recommendations to the group Collaborate with fab technicians and support experiment execution with clear instructions Assist engineering teams in process flow troubleshooting and metrology optimization strategies Apply statistical analysis and design experiments to enhance process reliability and throughput. Gain experience in materials and device characterization techniques, such as ellipsometry, xray-based techniques, 4-point probe, AFM, SEM and TEM.

Qualifications

Minimum Qualifications PhD student in Chemical Engineering, Electrical Engineering, Material Science, Physics, Chemistry, Mechanical Engineering, or a related field of study. Knowledge of semiconductor processing fundamentals, including thin films deposition, lithography, etching, polishing. Experience in thin films materials deposition techniques (ALD, CVD, PVD or electroplating) and characterization (ellipsometry, XRF, XPS, XRR, 4-point probe, AFM, SEM, TEM, etc.), hands-on lab/fab equipment experience Data analysis skills with demonstrated ability to construct clear data-based problem statements, design of experiment Preferred Qualifications PhD student 3rd or 4th year; experience with thin film deposition and characterization If you're eager to advance your expertise in semiconductor technology, collaborate in a supportive environment, and contribute to innovative solutions that shape the future of manufacturing, we encourage you to consider this

Listing verified 19m ago. Applications go through the company's official careers site.

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Module Engineering PhD Intern New 2027 at Intel, US, Oregon, Hillsboro | Yoinka