RF & Plasma Technologist
KLA Corporation
- Location
- Newport United Kingdom
- Work model
- On-Site
- Level
- Mid
- H-1B history
- 85 approvals (FY2023)
- Posted
- Sep 10, 2026
About this role
Company Overview The SPTS division of KLA, designs, manufactures and markets wafer processing solutions for the global semiconductor and related industries. SPTS provides industry leading etch and deposition process technologies on a range of single wafer handling platforms. End-market applications include micro-electromechanical systems (MEMS), advanced packaging, LED, high speed RF device IC’s and power semiconductors. SPTS is part of KLA Corporation which develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Group/Division SPTS wafer processing solutions include market-leading silicon etch, dielectric etch, dry-release etch, PVD, PECVD and molecular vapor deposition (MVD®), available with a range of wafer-handling options applicable to R&D, pilot production, or volume production environments. SPTS is headquartered and has its main manufacturing facility in Newport, UK, with additional manufacturing in Allentown, Pennsylvania. SPTS operates across 19 countries in Europe, North America and Asia-Pacific, and offers comprehensive service and spare parts support through a worldwide network of service centers and qualified local agents. Job Description/Preferred Qualifications Working as part of our Advanced Development group, this role is designed for an experienced technical expert who wants to remain hands-on while developing leadership capability. The RF & Plasma Technologist will design and develop RF sub-assemblies and plasma hardware for advanced semiconductor etch and deposition systems. The successful candidate will work closely with process, electrical, mechanical, software and manufacturing teams to create robust subsystem solutions that deliver world-class plasma performance.
KEY RESPONSIBILITIES
Plasma-hardware development Develop hardware associated with Etch & Deposition sources, electrodes, electrostatic chucks, gas distribution and chamber internals. Work with process engineers to relate hardware changes to plasma uniformity, ion energy, etch rate, selectivity and process repeatability. Apply vacuum, thermal, materials and contamination-control principles to subsystem design. RF sub-assembly development Design, model, build and test RF matching networks, RF feed structures, transmission systems and grounding assemblies at proto-type level Investigate impedance matching, power-coupling efficiency, losses, harmonics and parasitic current paths. Characterise performance using network analysers, RF voltage-current probes, oscilloscopes and other RF diagnostic tools. Generate specifications, drawings, test methods and development reports. Experimental development and collaboration Plan and conduct laboratory experiments, analyse data and document conclusions. Support troubleshooting, failure analysis and structured root-cause investigations. Support prototype build, system integration, qualification and release into product development. Coordinate design reviews, risk reduction and structured root-cause investigations for projects in Advanced Development Stakeholder engagement and innovation Support strategic customer engagements and communicate technical findings to internal and external stakeholders. Contribute to platform and subsystem technology roadmaps. Identify invention opportunities and support intellectual-property development. Technical leadership Work closely with electromagnetic, circuit and plasma modelling teams using tools such as COMSOL Multiphysics, Ansys HFSS and HPEM. Define design-verification plans and interpret RF, plasma and process diagnostic data Lead /present