Intel Process Integration Engineer - (BE)

Job Description: Join Intel and build a better tomorrow. What we do: The Intel Foundry MDCE and Logic Technology development (LTD) organizations delivers process technology innovation to drive Intel's product roadmap. What we offer: • We give you opportunities to transform technology and create a better future by delivering products that touch the lives of every person on earth. • As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. • We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation). • We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work. • We give you opportunities to transform technology and create a better future by delivering products that touch the lives of every person on earth.

We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and many more creative rewards that make Intel a Great Place to Work Find more information about our amazing benefits here. The ideal candidate should exhibit behavioral traits that indicate: Job Responsibilities include but are not limited to: 1. Process Flow Development • Develop and define integrated front end process flows for new technology nodes. • Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, and metrology teams. • Establish process windows and integration schemes. 2. Yield and Defect Reduction • Analyze yield loss and parametric failures. • Perform root cause analysis using statistical tools (SPC, DOE, FMEA). • Drive corrective actions to improve yield and cycle time. 3. Device Performance Optimization • Ensure electrical parameters meet design targets. • Work closely with device engineers to tune process conditions. • Optimize critical dimensions (CD), overlay, and film thickness. 4. Process Control and Monitoring • Implement control plans and process monitoring strategies. • Use statistical tools such as: Cpk / Ppk, Control charts, Capability analysis 5. Technology Transfer • Support ramp from RnD to high-volume manufacturing (HVM). • Document process specifications and standard operating procedures (SOPs). 6. Cross-Functional Collaboration/Work with • Device Engineering • Equipment Engineering/Module Engineering • Yield Engineering • Reliability Teams • Design Teams Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: •Candidate must possess a PhD degree in one of these fields: Electrical Engineering, Physics, Applied Physics, Optics, Material Science, Chemical Engineering, Mechanical Engineering, or related discipline. •Candidate must possess at least one of the following: 6+ months experience on one or more of the following areas: o Semiconductor device fabrication or nanotechnology. o Electrical characterization of transistors or other semiconductor devices. o Clean room process development. Preferred Qualifications: • JMP, MATLAB, Scripting languages (1.e. Python, JSL, TCL), or programming languages (1.e. SQL, C/C++). • Strong understanding of Device physics (CMOS, FinFET, GAA, etc) • Hand on experience in VLSI device fabrication and testing in the lab. • Knowledge of basic VLSI