Planar Nodes, Experienced Process Integration Engineer

About Samsung Austin Semiconductor Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow.  Come innovate with us!

Summary Samsung Foundry PIE team serves as the primary product owners who demonstrate total ownership from first silicon fab-in to final package. All roads lead back to product owners who connect design with fab process flows to achieve end customer product satisfaction. Drive new product introductions by checking margin of customer sample lots and corner lots, verifying new IP, and ensuring successful / on time product qualification. Implement CIP developed BKMs to drive work class yield and device performance. Resolve integration issues across wide range of product offerings that can have unique process margin weaknesses. Manage change points as key stakeholders in review board process to minimize risk and ensure successful implementation to achieve intended improvements. Urgently address customer quality feedback and claims to ensure a thorough resolution that builds customer confidence in Samsung Austin Semiconductor as the right business partner. Support development of yield learning models based on wafer sort or final test data to define root causes and institute countermeasures. Through these activities, Samsung Foundry Product Engineering targets robust yield, high quality, and efficient test operations are in place for Samsung’s advanced process technologies and its customers. Role and Responsibilities Here’s What You’ll Be Responsible For: Closely collaborate with teams: Process, DFM, Test, Device, Module QnR, Mfg and Customer to ensure manufacturability of Samsung’s products and rigorously analyze EDS/ET and process‑parameter data to translate wafer‑sort test results into actions to segregate EDS‑related anomalies from process related yield degradations Provide comprehensive silicon analysis from full array of data sources to model yield by driving strong characterization of process variations that demonstrate a high level understanding of key and critical controls necessary to achieve world class performance and yield.   Identify trends, devise innovative mitigation strategies, and resolve complex yield and defect challenges by leveraging high‑volume production data Monitor mass‑production performance, collaborate with fab engineering to root‑cause systematic issues, address processing abnormalities and drive yield to entitlement targets.  Continuously develop defense lines to improve detection and process controls to reduce risks and maximize production efficiency. Create and present professional presentations to share at executive and customer meetings.    Show flexibility to support a variety of fab initiatives (cost reduction, throughput, quality, work and process efficiency).

Here's what you'll need: Core Technical & Data Analysis Skills to identify CIP yield up activities/plans and root cause of abnormal events Data Mining: Extensive experience in data mining and statistical analysis using variety of data sources. Data Correlation & Yield Analysis: Proficient in mapping wafer sort bin and parametric data back to fab electrical test (E-test/WAT) results and in-line  SPC / FDC data to identify contributing factors to variations. Utilize Advanced Diagnostics to drive failure mode realization - skilled in utilizing layout viewers and knowledge of  DRC review.   Understands different failure analysis and metrology techniques for developing data collection plans.  Interpret eFA and pFA results.  New Product Introduction (NPI) & Technology Qualification NPI & Technology Development to Mass Production: Proven track record of participating in new product introduction (NPI) and advanced semiconductor technology node bring-up and qualification phases. Process