Senior Signal Integrity Engineer

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Packaging Engineering General Summary: This role represents an individual contributor within the CHS Signal Integrity organization responsible for end-to-end signal integrity and power integrity architecture, analysis, and signoff for next-generation mobile, compute, automotive, and various other connectivity platforms. The engineer acts as System SI/PI owner across full platform (SoC ↔ package ↔ board ↔ connectors ↔ external systems) Technical owner for high-speed interfaces and system margins Cross-functional leader driving SIPI driven design convergence across silicon, package, and platform teams Core Responsibilities Own end-to-end SI/PI closure for programs (pre-silicon → post-silicon → production) Define design targets and layout design guidelines for all high-speed interfaces Influence architecture decisions early in product lifecycle Ensure SI/PI alignment with product KPIs (performance, yield, power, cost) Ensure compliance to standards (JEDEC, PCI-SIG, MIPI, IEEE) Influence PDN architecture definition at system and package level, provide related optimum cost solutions Ensure cross functional alignments. Partner with SoC/PHY design teams, Package engineering, Board/system teams, and OEM/ODM ecosystem Lead design reviews and signoff decisions Represent SI/PI in program reviews and leadership forums Drive correlation between pre-silicon models and silicon/lab data Lead debug of eye collapse / jitter margin issues, crosstalk and power noise and silicon-package-board interactions Drive adoption of best practices across programs Drive improvements in methods for system SI/PI High-Speed Interface Expertise Drive SI/PI for interfaces such as: Memory: LPDDR4/5/6 High-speed IO: PCIe Gen4/5/6/7, USB4, UFS, 10G–112G+ PHYs Camera/Display: MIPI CSI/DSI System PDN Required Experience 4+ years’ experience in Signal Integrity / Power Integrity / High-speed systems Domain Expertise Expertise in Transmission line theory, EM fundamentals, SI/PI interactions, and jitter/noise coupling. Hands-on experience with: Tools such as HFSS, ADS, Sigrity, CST, SIwave, HSPICE; and measurement instruments such as VNA, TDR, real-time scopes Minimum Qualifications: •    Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ years of System/Package Design/Technology Engineering or related work experience. OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 1+ year of System/Package Design/Technology Engineering or related work experience. OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  disability-accomodations@qualcomm.com  or call Qualcomm's toll-free number found  here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies :   Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do