Staff Engineer, RMA

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Reliability Development Engineering General Summary: As a Return Merchandise Authorization (RMA) Engineer in Qualcomm's Customer Quality Team, you will be responsible for resolving product quality issues associated with RMAs. You will be assigned products to support RMA evaluation requests submitted by Qualcomm customers. Defect correlation will be achieved through system- and device-level evaluation techniques, utilizing a variety of fault-isolation and debug tools, including ATE, X-ray, CSAM, IV curve analysis, bench testing, phone testing, and PFA, among others. In this role, you will lead debug and data-gathering activities in partnership with other technical disciplines across Qualcomm. This position offers the opportunity to significantly influence product quality across the organization through direct interactions with customers and collaboration with cross-functional teams, including Design, Product Test Engineering, Marketing, Manufacturing, Supply Chain, and Customer Quality Engineering.

Provide leadership and lead major customer issues to resolution, reduce occurrences of No Fault Found & common mishandling issues such as EOS, ESD, Mechanical damage and SMT Reflow. Conduct technical evaluations of customer returned devices at system and device level utilizing tools such as ATE, XRAY, CSAM, IV curve and bench leading to a clear path of root cause. Act as the conduit between Qualcomm's customer, Product Core Team and Branch CQE. Introduce, implement, and improve processes (when necessary) between Customer/Branch & Qualcomm. Track actions, schedules and owners to maintain targeted RMA analysis cycle time. Initiate internal corrective actions where applicable. Drive improvement of internal quality systems with the goal of reducing outgoing product quality DPPM. Provide customer prospective (voice of customer) to internal stakeholders with the view to driving customer satisfaction metrics higher. Define priority among customer corrective actions to be taken within Qualcomm and guide the implementation within internal teams. Generate weekly/monthly/quarterly update reports to problem-solving teams and management. Update customers in a timely fashion regarding the status of open quality issues or support requests.    Minimum Qualifications: •    Bachelor's degree in Engineering, Material Science, Computer Science, or related field and 4+ years of Reliability Engineering (e.g., reliability analysis, stress testing) experience or related work experience. OR Master's degree in Engineering, Material Science, Computer Science, or related field and 3+ years of Reliability Engineering (e.g., reliability analysis, stress testing) experience or related work experience. OR PhD in Engineering, Material Science, Computer Science, or related field and 2+ years of Reliability Engineering (e.g., reliability analysis, stress testing) experience or related work experience. •    1+ year in a technical leadership role with or without direct reports. (applies only to positions with direct reports) Preferred Qualifications: Minimum of 10 years of experience with digital SoC products, semiconductor technologies, and system-level debugging. Experience analyzing and debugging customer issues involving application processors, CPUs, GPUs, DSPs, AI/NPU subsystems, memory, power management, and modem technologies, including LTE, WCDMA, CDMA, GSM, 1x, EVDO, and UMTS. Experience in microelectronics, SMT processes, semiconductor fabrication, assembly, and product quality engineering. Strong experience with quality methodologies, statistical analysis, root-cause investigation, and structured problem-solving techniques.

Strong understanding of Digital SoC architecture, including CPU, GPU, DSP, NPU/AI accelerators, cache hierarchy, memory subsystems, interconnects, power management, and clocking architectures.