SR ENGINEER, TDT DEVICE PI

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineer in the TDT (TD Taiwan) Device Team, you will drive DRAM device development projects supporting technology roadmap enablement, model delivery, performance optimization, reliability improvement, and technology transfer. You will collaborate closely with Technology Development organizations worldwide to advance next-generation CELL technologies from concept development through high-volume manufacturing. This role requires strong expertise in semiconductor device physics, process integration, electrical characterization, and data-driven problem solving. The successful candidate will provide technical leadership across multidisciplinary teams and leverage advanced analytics, AI-assisted engineering methodologies, and automation tools to accelerate technology development, root-cause analysis, and decision-making. This role requires strong expertise in semiconductor device physics, process integration, electrical characterization, and data-driven problem solving. The successful candidate will provide technical leadership across multidisciplinary teams and leverage advanced analytics, AI-assisted engineering methodologies, and automation tools to accelerate technology development, root-cause analysis, and decision-making.

Drive DRAM CELL device development projects supporting future technology roadmap requirements. Lead electrical characterization, margin assessment, performance optimization, and reliability improvement activities. Collaborate closely with Device, TCAD, Modelling, Design, Process Integration, and Manufacturing teams across global Technology Development sites. Identify device performance gaps and develop improvement strategies through experimental design, data analysis, and device physics understanding. Support technology transfer and manufacturing ramp activities by establishing device learning and monitoring methodologies. Utilize DOE, statistical analysis, and advanced characterization techniques to accelerate development learning cycles. Develop automated data analysis workflows and AI-assisted methodologies to improve engineering productivity and problem-solving effectiveness. Apply machine learning, predictive analytics, and large-language-model based tools to identify process-device correlations, accelerate root-cause investigations, and improve development efficiency. Drive continuous improvement in engineering workflows through digital transformation initiatives, data automation, and AI-enabled solutions. Contribute to the fundamental understanding of DRAM device behavior and its impact on product performance, reliability, and yield.

Master's or PhD in Electrical Engineering, Physics, Materials Science, Microelectronics, or related field. Technical Qualifications Strong understanding of semiconductor device physics, process integration, and characterization techniques. Experience in DRAM, memory devices, CMOS technologies, or advanced semiconductor development is highly desirable. Experience with statistical data analysis tools such as JMP, Python, CEDA, MATLAB, or equivalent. Knowledge of DOE methodologies and experimental optimization techniques. Experience with TCAD simulation tools (Sentaurus, Silvaco, or equivalent) is a plus. Familiarity with semiconductor manufacturing, technology development, and technology transfer processes. AI & Digital Engineering Qualifications Experience using AI-assisted engineering tools, machine learning, data mining, or predictive analytics in semiconductor development is preferred. Proficiency in Python, SQL, data engineering, or workflow automation tools is highly desirable. Experience developing automated analysis, dashboards,