Mechanical Engineer, Senior

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Mechanical Engineering General Summary:

This candidate will work as part of the CHS global mechanical engineering team. Responsibilities include the mechanical design of electro-mechanical enclosures including server rack platforms, outdoor cabinet enclosures, IOT, fixtures, and consumer mobile device test platforms. This process includes detail design, thermal simulations, tooling and fabrication, sourcing, product testing, and DFMA.

Design and develop detailed electro-mechanical test fixtures, and development platforms. Create detailed mechanical design, including 3D CAD models, assemblies, and manufacturing drawings. Electromechanical chassis and rack design of server test and production platforms. Create necessary documentation for sourcing, assembling, and sustaining assembly BOMs. Coordinating/sourcing prototype and production plastic, sheet metal, 3D printed, die-cast, and CNC machined mechanical assembly components including housings, heatsinks, cables, fixtures, chassis, etc. Interface with vendors and manufacturing partners to ensure design for manufacturability and support timely build schedules. Communicate and collaborate effectively with dynamic multi-disciplinary teams in various geographical regions. Develop effective thermal, structural, and tolerance analyses of mechanical assemblies. Effectively communicate and collaborate with multi-disciplinary design and supply chain teams across various geographical regions. Work onsite minimum 5 days/week in the Qualcomm office in San Diego, CA This senior mechanical engineer will interface with internal staff and outside suppliers in the fast-paced execution of a wide variety of multi-disciplined design projects.

BSME (Bachelors - Mechanical Engineering) 3+ years of relevant mechanical engineering experience Proficiency with 3D CAD tools (CREO or equivalent) Experience designing CNC machined, sheet metal, diecast, and injection‑molded components. Working knowledge of mechanical documentation, tolerancing, and GD&T.

Strong understanding of mechanical design in the electronics industry. 5+ years 3D solid modelling design tools experience utilizing CREO, Solid works, or equivalent platforms. 3+ years of design experience with plastic injection molded, die cast, chassis sheet metal, and CNC machined parts. 3+ years of experience developing mechanical constraints for printed circuit board assemblies. 3+ years electro-mechanical (PCBA) design experience. Experience using 3D thermal analysis software like Flowtherm or Icepak. Experience with structural analysis FEA tools. Experience with tolerance stack analysis of complex assemblies. Strong written and verbal communication skills. Top-down solid modelling experience with 3D design databases. Design constraint (EMN file) transfer experience between 3D CAD and PCB electronic CAD designs. Test/assembly fixture design experience Experience with PDM systems (Agile preferred) for BOM and project management Education Requirements         BSME (Bachelors – Mechanical Engineering) required; Minimum Qualifications: • Bachelor's degree in Mechanical Engineering or related field and 2+ years of Mechanical Engineering or related work experience. OR Master's degree in Mechanical Engineering or related field and 1+ year of Mechanical Engineering or related work experience. OR PhD in Mechanical Engineering or related field. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  disability-accomodations@qualcomm.com  or call Qualcomm's toll-free number found  here . Upon request, Qualcomm will provide reasonable accommodations to support individuals