Advanced Packaging Technical Leader

The application window is expected to close on: 08/14/2026 Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received . Meet the Team Cisco is seeking a seasoned Advanced Packaging Technical Leader to join the Packaging Technology & Quality team within our world-class Supply Chain Organization. As a Technical Leader you will drive innovation in advanced packaging technology and quality for Cisco’s cutting-edge Optics products.

You will operate at the intersection of advanced technology and strategic execution, working within a highly collaborative and multi-functional environment. This includes close partnerships with design engineering, operations, and supply chain teams to innovate next-generation technologies. You will also engage directly with counterparts at OSATs, Fabs, contract manufacturers and other key suppliers leading technical discussions and problem-solving efforts as well as influencing commodity strategy at a global scale. This role offers significant technical scope, cross-organizational visibility, and the potential to shape critical technology development and influence long-term product platforms. Key responsibilities: * Serve as a technical leader in advanced packaging technology (flip-chip, fanout, 2.5D/3D, hybrid integration). Oversee various aspects such as package assembly, process development, reliability qualification, materials and testing. * Work with top-tier package assembly partners to develop and qualify packaging solutions for Cisco products. * Multi-functional technical leadership to proactively identify and mitigate risks, and resolve highly complex packaging issues. Drive/support quality initiatives such as failure analysis (FA), root cause finding, and implementation of corrective actions. * Work collaboratively with design teams to influence package architecture and provide expert guidance on Design for Manufacturability/Reliability (DfM, DfR) contributing to the definition of critical parameters for HVM. * Contribute to evaluation of new packaging methods, materials and processes for Cisco product design and implementation. Minimum Qualifications : * MS or PhD in Mechanical Engineering, Materials Science/Engineering, Electrical Engineering, Physics or similar field. * 7+ years of progressive industry experience in Advanced Packaging with demonstrable track record of technical leadership and successful project execution. * Demonstrated experience in advanced packaging assembly processes (e.g fine pitch bumping, flip chip, molding, 2.5D, hybrid integration) * Deep expertise in Design for Manufacturing & Design for Reliability methodologies, specifically how packaging choices affect performance and yield Preferred Qualifications: Familiarity with industry standard reliability testing * Working knowledge of simulation and modeling software * Experience with basic failure analysis and root cause identification for packaging related issues. Why Cisco?  At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint. Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere.  We are Cisco, and our power starts with you.  Message to applicants applying to work in the U.S. and/or Canada: The starting salary range posted for this position is $171,600.00 to