Senior/Principal Optical Packaging Engineer

At Microsoft Research, we are shaping the next generation of AI infrastructure through long-horizon programmes spanning devices, systems, software and hardware. As a Principal Optical Packaging Engineer, you will own the package architecture and assembly strategy for emerging optical interconnect and co-packaged optics technologies as they move from research prototypes toward deployable infrastructure. You will join a multidisciplinary team working at the intersection of optics, electronics, photonics, packaging, networking, and AI system design. Working across research, Azure engineering, product teams, suppliers, and external partners, you will translate system-level optical, electrical, thermal, and mechanical requirements into package architectures, component specifications, assembly and process requirements, test vehicles, and qualification strategies, while working through trade-offs and risk management across optics, electronics, packaging, thermal, mechanical, networking, manufacturing, and reliability. You will bring experience across advanced semiconductor packaging and optical integration, work at the interface between research and productisation, and be able to problem solve around real-world constraints such as yield, assembly, cost, and reliability. In this role you will work hands-on with emerging technologies, collaborating with researchers, internal product teams, and Tier-1 partners to translate research into deployable systems.  Microsoft’s mission is to empower every person and every organisation on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realise our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.

Shape next-generation optical and advanced packaging technologies for AI infrastructure and high-performance computing. Work at the intersection of optics, photonics, semiconductor packaging, silicon, networking, and AI system design. Influence package architectures integrating photonic devices, electronic ICs, ASICs/chiplets, interposers, optical interfaces, and thermal solutions. Collaborate across research, engineering, sourcing, manufacturing, and product teams, as well as with industry partners. Help move technologies across the complete lifecycle, from architecture and prototype development through supplier qualification and production readiness. Translate advanced research and packaging innovation into scalable technologies with real-world product impact.

Required/Minimum Qualifications  Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Optical Engineering, Physics, or a related technical field, or equivalent practical experience. 5+ years of industry experience in advanced semiconductor packaging, optical/photonics packaging, heterogeneous integration, electronic packaging, or related hardware technologies. Experience in advanced packaging and assembly, in one or more of the following areas: 2.5D/3D integration, interposers/RDL, fine-pitch interconnects, die attach/bonding, underfill, moulding, adhesives, and thermal management. Experience integrating optical/photonics devices with electronic ICs and package structures, with an understanding of several of the following: optical coupling and alignment, electrical interconnects, thermal/mechanical behaviour, package reliability, and manufacturability. Hands-on experience in one or more stages of the package development and productisation lifecycle, including process characterisation, design validation, reliability qualification, failure analysis, DFM, and manufacturing readiness. Experience working with one or more types of external manufacturing or technology partner, such as foundries, OSATs, optical component/module suppliers, equipment suppliers, or material