Intern - Process Engineer

Intern - Process Engineer Intern Job Type (exemption status): Exempt position - Please see related compensation & benefits details below Business Function: Engineering Support Work Location: Pasir Gudang WD Media Office--LOC_WDT_MY0101 Company Description WD is building the infrastructure behind the AI-driven data economy. As AI scales, so does data. Every interaction, every model, every system generates data that must be stored, managed, and made accessible over time. That’s where we come in. We combine deep engineering expertise with global-scale manufacturing to deliver the storage systems that make AI possible, powering hyperscale data centers, cloud platforms, and enterprise infrastructure worldwide. This isn’t theoretical work. It’s real systems, at real scale, people solving some of the hardest challenges in technology today. We’re looking for people who want to build, solve, and operate at that level. Join us and let’s shape the future of data.

Job Summary This role as a Plating Process Control Engineer in manufacturing engineering operations is responsible for monitoring and controlling plating processes to ensure quality and yield targets while implementing process improvements and optimization initiatives. The role encompasses managing plating bath chemistry and refresh schedules, troubleshooting process deviations, conducting statistical analysis to support process changes, and ensuring compliance with contamination control procedures. Key technical competencies include understanding electroplating principles and chemistry, knowledge of semiconductor manufacturing processes, experience with process control systems and data analysis, and familiarity with cleanroom operations and safety protocols. The engineer also participates in FMEA activities, risk assessments, and supports change control processes such as PCN and TECN to maintain operational excellence in plating operations. ESSENTIAL DUTIES AND RESPONSIBILITIES: Focal person for plating facilities related issue, ie plating DI water trend monitoring, LPC and contamination Focal person of plating chemical planning and inventory Focal person for plating pretreatment, strip line, filter change and descaling. Monitor and control plating processes to ensure quality and yield targets Implement process improvements and optimization initiatives Troubleshoot process deviations and implement corrective actions, which including thickness control, anodic protection Troubleshoot line to line variation and implement corrective actions Ensure compliance with contamination control procedures Participate in FMEA activities and risk assessments Monitor and improve plating OEE performance Implement process optimizations to reduce speed losses and improve efficiency Track and analyze OEE metrics to identify improvement opportunities Support implementation of process parameter revisions to enhance OEE Qualifications REQUIRED: Must have a minimum of a Degree in Chemical Engineering or any engineering background PREFERRED: Fresh graduate or 1 - 3 years of experience in manufacturing/ production environment. Able to work in cleanroom environment. Must be able to use computer for communication (email / Microsoft Office applications & etc). Able to communicate in English.

Excellent Project Management skills; a strong communicator at all levels from Management to technical teams 'on the floor'. Self-motivated and goal oriented and will have the ability to work equally well in a team environment as well as individually. Very independently and less supervision required. Problem solution tools (6 Sigma, DOE, FMEA, 8D).

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