Principal/Staff, APTD - Advanced Packaging Wafer Level Technology Process Engineer

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Summary:    Playing a key role in developing and   enabling next-generation   advanced packaging technologies for future memory and semiconductor products. This position   is responsible for   process development, characterization, integration, and qualification of advanced assembly solutions, including hybrid bonding, thermo-compression bonding (TCB), flip chip, and emerging packaging technologies.     The engineer will lead technology development activities from concept through qualification and manufacturing transfer, working closely with cross-functional teams including Process Integration, Materials, Equipment, Reliability, Design, Manufacturing, and Quality organizations. The successful candidate will drive technical innovation, solve complex process challenges, and accelerate technology readiness to support Micron’s advanced packaging roadmap.

Process Development:      Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)     Upgrade process capabilities and reduce production costs     Establish and improve process management projects to deliver technology node requirements and scaling for next node.       Equipment and Materials:      Evaluate and promote new equipment and materials to enhance process capabilities     Set up process parameters for a variety of semiconductor equipment     Evaluate, promote, and plan for new equipment and materials       Quality Improvement:      Ensure defense coverage through process, measurement, inspection, and testing     Establish correlations between defense mechanisms to   identify   improvement opportunities     Conduct continuous data analysis to   establish   advanced controls and   identify   improvement opportunities       Collaboration and Coordination:      Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives     Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for   optimal   performance and quality control     Ensure smooth transition from new product development, qualification, small volume production to high volume production     Provide Process   Of   Record (POR) and Model   Of   Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities      AI Responsibilities:    Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and   complying with   organizational standards and legal requirements.    Contributes to a culture of continuous improvement by   identifying , testing, and sharing AI-enabled enhancements within one’s scope of work.       Candidate Profile   Minimum Required Qualifications :   PhD with ≥3 years or  Master’s  degree with ≥5 years, or  Bachelor’s  degree with ≥7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or  a related  field.   Demonstrated  expertise  in semiconductor process development, assembly, advanced packaging, or wafer processing.       Must Have