Substrate Quality and Reliability Engineer

Job Details: Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities.

As a Substrate Quality and Reliability Engineer you will drive substrate capacity expansion to influence key technology decisions for Intel package and assembly in TD and ramp phases. You will also be responsible to enable qual plans and strategies to meet product milestones and assess key risks to technology development activities at a component level and address product manufacturing challenges at substrate factories for future HVM stability. You will influence supplier process technologies and their interaction with assembly as well as substrate package induced customer facing issues and their validation. Role and Responsibilities include but are not limited to: - Develop, apply, and maintain quality and reliability standards for Substrate packaging components for Test Vehicle and Product. - Develop the integrated materials/process and technology targets to meet the requirements of product use case requirements and demonstrate maturity milestones. - Define inspection, screening, and testing mechanism to mitigate yield and reliability risks. - Determine reliability requirements to achieve reliability objectives. - Develop reliability models by performing statistical analysis to more accurately categorize reliability risk to customer specification and field risk. - Deliver standardization in product qualification, manufacturing quality systems, and methods. - Influence, enable, and continuously engage with packaging technology development and partner engineering teams on process maturity to lower risks. - Develop new acceleration techniques, analytical tools, and quality screens to ensure the early identification of potential problems with every new technology and process. - Respond to customer requests or quality events as they occur - Make proactive recommendations for changes in specification or formulation to improve product quality and reliability.

The ideal candidate should exhibit the following behavioral traits: - Influence cross-functional teams and solve complex technical challenges and deliver robust solutions. - Thrive in ambiguous environment and competing priorities and provide technical and analytical problem solving. Qualifications: Minimum Qualifications: - Master's degree with 2+ years of industry experience OR PhD degree in Materials Science, Electrical Engineering, Physics, Chemistry, Mechanical Engineering, Aerospace Engineering, Chemical Engineering, or a related engineering discipline.  - 2+ years of experience in at least one of the following areas: substrate manufacturing, semiconductor fabrication, package assembly, wafer-level processing, or board/system integration. - Demonstrated ability to collaborate across cross-functional teams. Preferred Qualifications: - 1+ years of experience in empirical data collection and statistical data analysis, reliability statistics, and design of experiments. - Technical background in any of the below mentioned areas of substrate or semiconductor or Intel package technology with proficiency in one or more areas of manufacturing process development, material characterization, and development design validation. - Technical understanding of capacitor, inductor, resistor passive component manufacturing process, functionality and testing procedures. - Technical understanding of active component fabrication, functionality and testing procedures. - Technical understanding of Intel's product certification methodology and integrated package risks with knowledge of modulators and controls. - Technical understanding of accelerated life testing methods and reliability statistics. - Programming or scripting experience for data analysis, such as Python or SQL. - Ability to lead and influence cross-functional teams while effectively communicating complex concepts to diverse audiences. - Problem solving techniques such as model based problem