Staff Engineer, Advanced Packaging Technology Development

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an Engineer in Packaging Technology Management at Micron, you will have an outstanding chance to influence and lead the development of world-class packaging technologies. You will work in a collaborative and innovative environment. This role allows you to operate at the forefront of technology in Taiwan, contributing to Micron's strategic goals and helping build the future of the semiconductor industry. AI Proficiency and AI-Enabled Ways of Working Micron is committed to building an AI-enabled workforce. Successful candidates are encouraged to bring to bear approved AI technologies and analytics to improve engineering efficiency, accelerate innovation, improve technical decision making, and streamline collaboration. This includes applying AI-assisted tools for data analysis, technical research, knowledge discovery, workflow automation, competitive intelligence, and technical communication while adhering to Micron policies for responsible AI use, information security, and data governance. Responsibilities and Duties include, but not limited to: Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value. Collaborate continuously with internal and external partners to ensure flawless technology integration. Consult and influence technical and strategic decisions at senior management levels. Lead multi-disciplinary technical teams and task forces to achieve strategic goals. Examine and interpret competitive trends to strengthen Micron’s position in the market. Participate actively in technology events, contributing to industry knowledge. Direct the creation of packaging technology roadmaps. Analyze competitive metrics through data intelligence, AI-supported analysis, and market insights to pinpoint strategic opportunities and boost Micron's competitive position. Identify and drive opportunities to improve engineering efficiency through AI-assisted workflows, automation, knowledge management, technical documentation generation, and cross-functional teamwork. Define requirements with proven technical data and content. Demonstrate profound technical expertise to develop new technologies and guide others. Build an extensive technical network across various domains. Troubleshoot sophisticated issues, providing mentorship for resolution. Innovate continuously through patents, trade secrets, technical presentations, and papers, leading to build wins and quality improvements. Engage in and promote ongoing cost reduction and quality improvement initiatives. Qualifications and Skills: Over 5 years of professional experience in semiconductor advanced packaging. BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field, or equivalent experience. Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies including Hybrid bonding (Required). Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process (Required). Experience in DRAM manufacturing and OSAT companies (Required). Understanding of DRAM wafer structure and process flows (Highly Preferred). Proficient in English, with additional language skills in East Asian languages being highly preferred. Proven ability to apply AI-enabled engineering tools, data analytics platforms, and digital technologies to improve technical efficiency, accelerate innovation, improve decision-making, and drive engineering efficiency. Understanding of responsible AI practices, data governance, and secure use of enterprise AI solutions in a technical development environment. A passion for innovation