Staff Failure Analysis Engineer - Advanced Packaging Technologies

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: We are seeking a highly skilled and motivated Failure Analysis Engineer to lead the development and enablement of FA test interfaces, advanced socketing, and thermal management solutions in support of Electrical Fault Isolation (EFI). This role plays a critical part in enabling design debug, yield improvement, and RMA analysis across Qualcomm’s diverse product portfolio. With the rapid emergence of Cloud, Compute, and Automotive products featuring large package sizes, high pin counts, and advanced packaging technologies, traditional design and process flows for FA testing are increasingly challenged. The successful candidate will develop innovative hardware methodologies and FA‑specific interface solutions to ensure robust and scalable fault isolation capability for next‑generation products. Minimum Qualifications: • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.

Lead FA test interface enablement across all Qualcomm product lines, including Mobile, Compute, Automotive, Networking, and AR/VR Embedded platforms. Proactively plan, develop, and deploy FA‑specific hardware such as custom sockets and carrier boards to support both ATE‑based and platform‑based testing environments. Define and optimize the minimum viable set of socket and interface variants required to support comprehensive FA test scenarios, ensuring hardware readiness by Silicon on Dock (SOD). Design, evaluate, and deploy thermal management solutions tailored to FA use cases for high‑power (high‑TDP) devices across Cloud, Compute, and Automotive segments. Utilize thermal and electrical analysis tools to assess performance, reliability, and feasibility of FA hardware solutions. Develop detailed hardware specifications and collaborate closely with internal teams and external suppliers to integrate socketing and thermal solutions into the FA workflow. Partner with cross‑functional teams including Design, Product Engineering, Yield, and Reliability to align FA hardware capabilities with evolving product requirements. Continuously evaluate emerging technologies and packaging trends to evolve FA interface and socketing strategies.

Strong foundation in electrical engineering with hands‑on experience in hardware design, test interfaces, or FA enablement. In‑depth understanding of socketing technologies, power delivery challenges, and signal integrity for advanced semiconductor packages. Experience supporting FA or debug activities for complex SoCs, high‑pin‑count devices, or large advanced packages. Familiarity with thermal analysis and mitigation techniques for high‑power semiconductor devices. Ability to translate FA requirements into clear, actionable hardware specifications. Strong collaboration and communication skills to work effectively across multidisciplinary and global teams.

Requirements Required: Bachelor’s degree in related discipline. Preferred: Master’s degree in Electrical Engineering or related discipline Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail  disability-accomodations@qualcomm.com  or call Qualcomm's toll-free number found  here . Upon request, Qualcomm will provide reasonable accommodations to