Process Engineer Intern, MS - Summer 2027

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.  At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.  Your Team, Your Impact In this role, you will support Marvell's AI Products team and gain hands-on exposure to the assembly and packaging technologies — including 2.5D/3D chip-on-wafer development and co-packaged optics — that bring AI silicon from concept to high-volume manufacturing. These technologies are foundational to how Marvell's AI silicon achieves the performance, density, and bandwidth needed for next-generation data center infrastructure. Responsibilities include supporting data tracking for foundry and OSAT partner activities, helping document risks and mitigation plans during the New Product Introduction (NPI) phase, and contributing to reports summarizing technical progress. This role suits someone curious about semiconductor manufacturing and advanced packaging, with strong communication skills and a proactive attitude toward fast-paced, hands-on learning. What You Can Expect Support process development activities for 2.5D/3D chip-on-wafer assembly and co-packaged optics in collaboration with foundry and OSAT partners Track and analyze data related to packaging builds to help identify trends and potential risks during NPI phase Document risks and mitigation plans as products mature toward high-volume manufacturing readiness Participate in partner and internal team meetings to gain exposure to design-for-manufacturing, process development, reliability and cost-tradeoff discussions What We're Looking For Currently enrolled in a Master's Degree in Materials Science, Chemical Engineering, Mechanical Engineering, Chemistry, Physics, or a related field with an expected graduation date of Fall 2027 – Summer 2028 Coursework or academic project experience related to semiconductor processing, materials science, or packaging/assembly technologies Familiarity with data analysis and organization using tools such as Excel, JMP, or Minitab Strong written and verbal communication skills, with the ability to summarize technical information clearly for cross-functional audiences Demonstrated ability to work independently and manage multiple tasks in a fast-paced environment Exposure to advanced packaging concepts such as 2.5D/3D chip-on-wafer assembly or co-packaged optics through coursework, research, or internship experience Familiarity with programming or scripting languages such as Python for data analysis Prior internship or research experience in a semiconductor, manufacturing, or process engineering setting Basic understanding of reliability testing or failure analysis concepts Expected Base Pay Range (USD) 37 - 73, $ per hour. The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions. 
This role is eligible to participate in Marvell's bonus and equity plans, including a new hire equity grant and annual equity refreshers, ensuring you are rewarded for your contributions and remain invested in the company's long-term success.
 Additional Compensation and Benefit Elements   Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health,