Intern - HIG PSE IE Management

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location F10A Singapore, 1 North Coast Avenue Singapore 757432 Department High Bandwidth Memory Product and Systems Engineering, Industrial Engineering Management   Project Title AI-Enabled High Bandwidth Memory Sample Planning and Workflow Optimization   Project Description As an intern in the High Bandwidth Memory Product and Systems Engineering Industrial Engineering team, you will participate in a structured project to improve the visibility and planning of High Bandwidth Memory sample workflows through data analytics, dashboard development, and Artificial Intelligence. The project focuses on mapping the end-to-end sample workflow from Die Bank through probe, test, shipment, and the Reliability Lab. The intern will develop an AI-Enabled solution to predict sample arrival and reliability start dates, forecast burn-in resource demand, automate selected notifications, and provide operational insights through interactive dashboards. The internship provides hands-on exposure to semiconductor sample logistics, process documentation, predictive analytics, business intelligence, and workflow optimization. The intern will collaborate with engineering, planning, operations, and information technology stakeholders to translate data insights into practical improvement recommendations.   Objective of the Project Map and analyze the end-to-end High Bandwidth Memory sample workflow from Die Bank to the Reliability Lab. Develop predictive models for sample arrival and reliability start dates. Forecast burn-in and reliability resource demand to improve planning. Create dashboards and automated notifications that improve sample visibility and risk monitoring. Identify opportunities to improve workflow efficiency through data analytics and AI-Enabled solutions.   Opportunities for Full Time Employment High-performing interns who demonstrate strong technical capability, learning agility, and successful project outcomes may be considered for future internship or full-time employment opportunities, subject to business needs and hiring requirements.   Project Scope Map and document the end-to-end High Bandwidth Memory sample workflow across Die Bank, probe, test, shipment, and reliability operations. Collect, clean, and analyze sample-management data from relevant manufacturing and planning systems. Develop predictive models and automated notifications for sample arrival, readiness actions, and reliability start dates. Build Power BI or Tableau dashboards for work-in-progress tracking, resource forecasting, capacity visibility, and execution-risk monitoring. Identify workflow bottlenecks and recommend opportunities for process improvement and automation.   Learning Opportunities Gain exposure to High Bandwidth Memory sample logistics and semiconductor reliability operations. Develop practical experience in data preparation, predictive modelling, dashboard development, and workflow automation. Learn how Manufacturing Execution Systems and enterprise planning systems are used to manage manufacturing information. Strengthen process-mapping, structured problem-solving, technical documentation, and stakeholder-communication skills. Explore applications of Artificial Intelligence and AI-Enabled workflows in semiconductor planning and operations.   Deliverables End-to-end High Bandwidth Memory sample-flow map and process documentation. AI-Enabled sample-arrival and reliability start-date prediction model. Automated alert prototype for upcoming