Lead Engineer, Yield Analysis

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Yield Analysis Module Lead, you will leverage advanced data analytics and deep process knowledge to identify, characterize, and quantify key yield limiters within assigned fab modules. You will lead rigorous investigative efforts to determine root causes of yield excursions, develop and publish actionable yield paretos, and translate complex data into clear technical direction for improvement. Working closely with the YA PTO team, Process Integration, and Process Engineering, you will provide accurate, data-driven guidance to the fab, influence corrective action strategies, and drive sustainable yield improvements. This role offers direct ownership of yield performance and a critical opportunity to impact continuous improvement across the manufacturing line. Lead and maintain an effective training and development program, providing coaching and mentorship to elevate team proficiency and support growth of direct reports. Proficient in Module based Data Analysis, Part Type Ownership Analysis and new part setup activities Track probe yield performance and trends to identify, characterize, and explain gaps between target and actual yields. Perform advanced data analysis to quantify yield issues and generate accurate yield paretos that guide fab priorities and improvement efforts. Apply statistical and data‑mining techniques to identify root causes and uncover opportunities for sustainable yield improvement. Collaborate closely with PI, Probe, PE, EFA, and PFA teams to correlate electrical signals, probe signatures, and physical findings into actionable insights for process teams. Partner with module, inline monitoring, and global teams to implement, monitor, and standardize yield fixes, leveraging strong semiconductor process, defect, and metrology knowledge. Discover yield issues in NAND development and identify unique metric or combination of metrics, such as wafer/dice/tile shading, ECATS or other custom metric for issues quantification Interact with process area, process integration, yield, failure analysis, product engineering, design, and layout teams to drive clear definition of yield, cell, CMOS, qual, and reliability issues and pareto and derive improvement actions needed across tech-nodes and designs Own and drive non-standard deep dive statistical analysis of inline, probe, cell, and other critical metrics to define issues/problems, enable early inline detection, and improve the product yield and quality. Quantify and track progress on the issue hit hate, line impact, gap to program goal. Quantify yield improvement/downside seen based on process/probe changes Initiate data mining and correlation study on new issue seen. Initiate PFA request to identify root cause of yield issue. Perform inline correlation study to establish inline prediction to yield issue. Make yield projections based on expected improvement/downside. Conduct yield trend analysis, identify root causes in process step, conversion, algorithm change, and design, for yield shift Continuously develop/re-define inline detection in collaboration with metrology and RDA team Identify and define gaps with current test and co-develop (with product, probe, param engineering) unique parametric/probe bins to detect new fail modes as well as validate new program release Collaborate with module owners to identify, quantify key module deficiencies/technology gaps, and drive cross-functional teams to address. Optimize existing layout, conceptualize, and develop innovative solutions to meet product requirements and manufacturability Develop and innovate techniques in extracting data from different databases through various query languages and automate through