Sr Architect, Technical Product Manager (3DIC Packaging)

We Are Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with customers across industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. You Are You are a senior technical product leader with hands-on experience in IC packaging design, package analysis, and production tapeout flows. You have worked directly with multi-die and package layout tools, and SI/PI, thermal and mechanical analysis flows. You understand 2.5/3DIC, chiplet, HBM, photonics, and co-packaged optics architectures and can engage credibly with architects, silicon and package engineering teams, foundries, OSATs, and ecosystem partners. This Technical Product Management role requires substantial engineering depth. Success depends on understanding the technology, design flows, and implementation challenges well enough to guide roadmap priorities, define detailed requirements, and validate solutions against real packaging problems. What You’ll Be Doing Develop the technical roadmap for multi-die advanced package design, implementation, and signoff analysis. Engage with customers, foundries, and OSATs to translatepackaging challenges into prioritizedrequirements. Evaluate the competitive landscape, emerging technologies, and evolving design methodologies to guide roadmap priorities and position Synopsys offerings with technical clarity. Work hands-on with engineering teams to define capabilities, evaluate technical tradeoffs, andvalidatesolutions across silicon, advanced package, and package substrate flows. Drive cross-functional delivery of solutions addressing package implementation, SI/PI, multiphysics ,and manufacturing challenges. Advance AI-driven and agentic workflows for multi-die design, multiphysics analysis, and optimization. Present the technical product vision and roadmap to executives, customers, and ecosystem partners, and represent Synopsys at industry events and standards engagements. Provide technical direction tofield teams supporting customer evaluations and deployments. The Impact You Will Have Enable next-generation AI accelerators, high-performance computing, and data-center silicon built on advanced multi-die architectures. Expand Synopsys’multi-diepackaging presence through differentiated package design, multiphysics analysis, and production solutions. Drive adoption across semiconductor companies, hyperscalers ,and design service providers by aligning product capabilities with production tapeout requirements. Strengthen foundryand OSATpartnerships through technical roadmap alignment and co-development. Enable customers to scale multi-die advanced packages by addressing complex implementation, SI/PI, thermal, mechanical, and system integration challenges. What You’ll Need 15+ years of semiconductor IC and packaging experience. Deep technical knowledge of ICand packagedesign, analysis, manufacturing, and production tapeout . Hands-onexpertisewith industry-standardsilicon and packagedesign tools, SI/PI analysis tools, and related production flows. Expertisein signal integrity, power integrity, EMIR, thermal, and mechanical analysis for advanced packages. Experience with2.5D/3DIC,chiplet, HBM, photonics, and co-packaged optics architectures&methodologies. Familiarity with high-speed interfaces such as PCIe, DDR, and HBM in the context of packagedesign & signoff. Understanding of