Process Engineer 5 (Advanced Packaging Integration Technologist)

The group you’ll be a part of

The Advanced Packaging Integration Group focuses on driving differentiated solutions from Lam to enable customer heterogeneous integration product and process roadmaps through orchestration of joint projects and integrated test vehicles with ecosystem partners including research institutes, consortia, universities, and peer companies. The Technology and Ecosystem Engagements Group enables a virtual integration center for Lam product groups and customer engagement teams to drive accelerated studies to understand and resolve challenging process integration problems and deliver unique and effective product solutions to meet future customer roadmaps.

The impact you’ll make

In this role, you will directly contribute to expanding Lam Research's Advanced Packaging technology leadership and industry influence by leading and executing complex JDPs and research programs that create measurable business value across engineering, manufacturing, supply chain, and business operations. You will partner with engineers and leaders across multiple product groups and customer account teams across Lam as well as external ecosystem leaders to orchestrate a virtual integration center that enables faster decision-making, operational efficiency, innovation, and strengthens Lam's competitive advantage. You will collaborate and generate integration flows that meet manufacturability and reliability requirements to drive novel technology development options. You will also represent Lam Research as a technology ambassador at industry conferences and symposiums, enhancing our vision and strategy of advancing technology through strong ecosystem collaborations.

Subject matter expertise in logic and memory advanced packaging integration including 2D/2.5D/3D, WLP, HBM, etc. Ability to synthesize customer AP roadmap needs, generate process integration flow options, identify unit process challenges, and propose solution paths to enable highest possible product performance, yield, and reliability. Engage closely with PG engineering and customer account technologist teams on test vehicle needs for improved unit process development and characterization, help develop test vehicle flows. Study system-level co-optimization trends across different logic and memory product and process segments, identify emerging challenges and critical HW and process needs that Lam products need to develop to stay differentiated and ahead of competition. Design experiments, lead data analysis, and drive systematic root-cause + corrective actions as needed to resolve process integration problems. Along with ecosystem engagement lead and program managers, develop clear JDP scope, objectives, KPIs/success metrics, and milestones. Engage and lead collaborations with peers/partners/startups to define, execute, and implement co-optimized integration strategies and solutions. Drive JDPs with materials suppliers and metrology companies to realize and enable new avenues for co-development and characterization. Stay up to date on advanced packaging research, pathfinding, and innovations and assist product marketing leaders in market assessments, competitive intelligence reports, strategic initiatives, and portfolio gap analysis. Support customer engagement meetings and escalations related to integrated problems. Represent Lam at industry conferences and symposiums to expand network, influence, and branding. Support mentoring and recruitment for the ecosystem team.

Who we’re looking for

Master's or PhD in Engineering (electrical/mechanical/chemical), Materials Science, Applied Physics, Chemistry, or a related discipline. 10+ years of experience in semiconductor process development, packaging integration (TSV, WLP, HB, panel level packaging etc.), model-based problem solving, program management, or related business functions within a complex enterprise environment. Strong fundamental understanding of