Master Thesis: Aging and Compatibility of Silicone-Based and Silicone-Free TIMs

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 About this opportunity: Efficient thermal management is increasingly important in modern electronics, where higher power density and long service life place greater demands on thermal interface materials (TIMs). Thermal greases and other dispensable TIMs use thermally conductive fillers in a polymer matrix. Silicone-based and silicone-free matrices can differ significantly in viscosity, wetting, oil bleed, migration, pump-out, material compatibility, and long-term thermal resistance. This thesis will investigate how silicone-based and silicone-free TIMs change during aging and how chemical and physical degradation affects thermal performance and compatibility in electronic products. The work will examine the effects of heat, oxygen, humidity, and mechanical stress, including combined or cyclic conditions, and link material changes to measurable reliability and performance outcomes. The results will support material selection and provide evidence-based guidance on whether silicone-based thermal greases could replace silicone-free alternatives under defined product, process, cleanliness, reliability, and compatibility conditions.

Review literature on TIM chemistry, additives, fillers, degradation, migration, and material compatibility. Select representative silicone-based and silicone-free TIMs and characterize their chemical, physical, rheological, and thermal properties before and after accelerated aging. Study degradation caused by heat, oxygen, humidity, and mechanical stress using suitable analytical methods and equipment. Relate chemical and structural changes to viscosity, flow, wetting, oil bleed, migration, pump-out, dry-out, bond-line stability, and thermal resistance. Evaluate compatibility with representative electronic materials and surfaces, including circuit boards, component finishes, vapor chambers, heat sinks, coatings, adhesives, plastics, and metals. Compare the benefits, limitations, failure mechanisms, and application risks of silicone-based and silicone-free systems. Develop recommendations for material selection and reliable use in electronic cooling applications. Some characterization equipment, such as DMA, is not available at Ericsson and may need to be accessed through university facilities. The skills you bring: You are pursuing a Master’s degree in Materials Science, Chemical Engineering, Chemistry, or a related field. You have an interest in polymers, thermal interface materials, material compatibility, degradation, and reliability. Knowledge of analytical chemistry, rheology, thermal analysis, materials characterization, or reliability testing is an advantage. You are analytical, systematic, and comfortable combining laboratory work with data analysis. You are able to work independently and draw clear conclusions from experimental results.   Why join Ericsson? At Ericsson, you´ll have an outstanding opportunity. The chance to use your skills and imagination to push the boundaries of what´s possible. To build solutions never seen before to some of the world’s toughest problems. You´ll be challenged, but you won’t be alone. You´ll be joining a team of diverse innovators, all driven to go beyond the status quo to craft what comes next.   What happens once you apply? Click Here to find all you need to know about what our typical hiring process looks like.Encouraging a diverse and inclusive organization is core to our values at Ericsson, that's why we champion it in everything we do. We truly believe that by collaborating with people with different experiences we drive innovation, which is essential for our future growth. We encourage people from all backgrounds to apply and realize their full potential as part of our Ericsson team. Ericsson is proud to be an Equal Opportunity Employer.  learn more.   Primary country and city: Sweden (SE) || Stockholm Req ID:  789946