BSP SW Customer Engineer

Company: Qualcomm China Job Area: Engineering Group, Engineering Group > Software Applications Engineering General Summary: Company Overview Qualcomm Technologies, Inc. is a world leader in wireless technology innovation and the driving force behind the development, launch, and expansion of 5G. Our Industrial Connectivity Business Unit delivers cutting-edge connectivity solutions — including Wi-Fi 6/6E/7, Bluetooth 5.x, Thread/Matter, Zigbee, and 5G/LTE — purpose-built for industrial IoT, smart manufacturing, robotics, and Industry 4.0 applications. The Xi’an R&D and application engineering team plays a strategic role in supporting Qualcomm’s growing industrial customer base across China and the broader APAC region.

Summary We are seeking a highly motivated Senior Application Engineer based in Xi’an to join our Industrial Connectivity Business Unit. You will serve as the primary technical interface between Qualcomm and our industrial customers, ODM/OEM partners, and ecosystem collaborators in China. The core focus of this role is RTOS BSP (Board Support Package) development and enablement — you will own the bring-up, porting, and optimization of Qualcomm connectivity chipset BSPs on customer hardware platforms running RTOS environments. Experience with Qualcomm MDM (Mobile Data Modem) platforms is a strong plus. You will drive successful adoption across the full product lifecycle: from pre-sales technical engagement and BSP design-in support through to production optimization and field issue resolution. Strong English communication skills are essential, as you will collaborate daily with global engineering, product, and business teams.

Customer Technical Engagement: Serve as the primary technical point of contact for industrial customers and ODM/OEM partners in China; understand customer hardware platforms, RTOS environments, and connectivity requirements to propose and enable optimal Qualcomm BSP solutions. RTOS BSP Bring-Up & Porting: Lead end-to-end BSP bring-up of Qualcomm connectivity chipsets on customer target boards; port and adapt BSP components — bootloader, clock/power management, GPIO, UART/SPI/I2C/USB peripheral drivers, interrupt controllers, and memory maps — to customer-specific hardware under FreeRTOS, ThreadX, Zephyr, or equivalent RTOS. Board Bring-Up & Hardware Validation: Collaborate with customers on hardware schematic review, PCB layout guidance, and signal-integrity analysis; execute board bring-up procedures, validate BSP functionality against hardware specifications, and document bring-up checklists and test results. Qualcomm MDM Platform Support: Support customers adopting Qualcomm MDM-series platforms (QIM series) for industrial LTE/5G connectivity; guide BSP-level integration of MDM firmware, AT command interfaces, data call management, and FOTA/SOTA update mechanisms. Technical Issue Resolution: Investigate and resolve complex customer-reported BSP and firmware issues — including boot failures, driver crashes, RTOS scheduling anomalies, and wireless stack integration defects; use JTAG/SWD debuggers, logic analyzers, QXDM, and oscilloscopes to isolate root causes; collaborate with Qualcomm global R&D to drive fixes. Cross-Functional & Global Collaboration: Work closely with global Product Management, R&D, and Sales teams — primarily in English — to relay customer BSP feedback, influence chipset and SDK roadmaps, and develop reference BSP packages, application notes, and integration guides. Documentation & Knowledge Sharing: Author BSP porting guides, bring-up checklists, driver API references, and troubleshooting FAQs in English; maintain internal knowledge bases and contribute to customer-facing developer portals.

Bachelor’s degree or above in Electrical Engineering, Computer Engineering, Computer Science, Embedded Systems, or a related technical field. 5+ years of experience in embedded systems engineering, BSP