Senior Director, Engineering

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: About the Team & the Opportunity Qualcomm Technologies is scaling from silicon leadership into full rack-scale data center systems. Our Qualcomm® solutions deliver purpose-built, rack-level AI inference — paired with our data center CPU roadmap — to multiple global customers solutions These are complete, serviceable systems: direct to chip liquid-cooled racks & solutions, PCIe for scale-up, Ethernet for scale-out, computing for secure workloads all managed by the Qualcomm AI Infrastructure Management Suite. With our recent announcements into high-speed connectivity, SerDes, and chiplet expertise to the platform. This role is central to helping turn that portfolio into designs our key customers & ODMs can deploy at scale.

Summary We are seeking a Senior Director to help set the forward-looking strategy across rack architecture design and thermal implementation across new areas and be a part of a core team that helps the organization design, test and deploy across multiple product lines and multiple generations as well as internal test racks. You will help lead the mechanical areas tied to rack design and deployment, interface closely with multiple business units and engineering teams as well as ODM / OEM build, test and scale out. This is the Senior Technical Leader who ensures every generation is designed to be built, cooled, deployed, and serviced in real data centers.

Set multi-generation rack strategy:  Help lead, scope, design and set the architecture and roadmap for rack-scale platforms across generations, balancing performance, TCO, power, thermal, memory, and serviceability. Own executive ODM/OEM & customer relationships:  Be the senior engineering counterpart to ODM/OEM partners and customers — shaping joint roadmaps, design partnerships, and deployment commitments. Drive thermal & power leadership:  Set the liquid-cooling and high-density power strategy (direct-to-chip, CDUs, 2Phase DLC, immersion, high-power busbars) and keep Qualcomm ahead of where the industry is heading. Own deployment at scale:  Ensure rack platforms move from NPI through validation to reliable, high-volume field deployment; institute operations, RAS, and fleet-health practices that scale. Represent Qualcomm externally:  Engage in industry standards (e.g., OCP) and represent the rack platform strategy with customers, partners, and executives. Align the enterprise:  Partner across silicon, software, networking, supply chain, operations, product, and finance to deliver a coherent, buildable, deployable platform strategy.

Education: bachelor’s degree in an approved engineering field — Mechanical, Thermal, HW Engineering (or a closely related engineering discipline). Master’s degree is preferred.

Around 18+ years in server/data center hardware and rack-scale systems, including 10+ years in engineering leadership — with proven experience leading others. Server-space rack design (hands-on):  12+ years of direct, hands-on industry experience designing server and rack-level hardware — mechanical/electrical/thermal integration, power distribution, cabling/interconnect, and full rack assembly — not adjacent or purely managerial exposure. Liquid cooling & emerging trends: Deep working knowledge of direct-to-chip / cold-plate liquid cooling, coolant distribution (CDUs, manifolds, blind-mate connectors), rear-door heat exchangers, and immersion — plus a clear point of view on where high-density thermal, power, and rack trends are heading. Operations experience: Proven ownership of hardware operations — NPI-to-volume ramp, quality, RAS, serviceability, sustaining engineering, and fleet-health practices for systems running in production. Deployment experience: Track record taking rack-scale systems from bring-up and integration through