Board Engineer, Senior Staff
Qualcomm
- Location
- San Diego, California, United States of America
- Work model
- On-Site
- Level
- Staff
- H-1B history
- 22 approvals (FY2023)
- Posted
- Aug 18, 2026
Skills
About this role
Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Job Title Board Engineer , Sr S taff Location San Diego - US Job Overview Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in. Role / Skills / Exp The successful candidate will operate as a member of the Central Hardware Systems Board design & layout team , and will be able to d esign and document printed circuit board layouts that conform to manufacturing and industry standards and Qualcomm design guidelines. You’ll collaborate with Data Center PDM, PM & E ngineering teams to help design and implement schematics and constraints into high-quality PCB layouts for advanced breakouts + layout designs across Data Center, Server & C ompute reference design for m factor accurate platforms. Key Responsibilities include Design & Layout PCB s for referenc e & test DC , IOT , Server, C ompute & 6G R&D systems, including form factor accurate (FFA) reference platforms and high-volume circuit boards. Engineer high-speed, multi-layer stack-ups encompassing application processors, digital processors, RF/radio circuits, and power delivery networks. Utilize advanced manufacturing techniques: stacked micro-vias, sequential lamination, and small-pitch package design rules. Collaborate effectively with internal teams in the U.S. and design partners globally to deliver high-performance PWB solutions. Liaise with internal stakeholders and external vendors to support HW platform & PCB fabrication and assembly throughout the product lifecycle. The candidate is expected to have proficiency on Siemens/ Mentor Xpedition, Altium or Cadence Allegro P C B design software and is expected to have experience in developing P C B design solutions for a variety of design types and working with internal teams and external suppliers to support P C B fabrication and assembly.
Minimum Qualifications
Experience using Xpedition or Allegro PCB design tools Familiar with COTS IOT Interfaces . Proficient with all MS Office 365 Tools. Understanding of how to use AI to efficiently solve problems. 12 + years actively involved in PCB high speed design. 12 + years actively involved in P C B design for HDI & high-density electronics packaging. 10 + years experience in a P C B design role designing consumer-grade p roducts or low volume test products utilizing latest generation processor chips & ICs . Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.
Education
Requirements BS Electrical or Equivalent Engineering or equivalent work experience Minimum Qualifications: • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
Preferred Qualifications
Experience as a Board design Engineer across HS layouts . Knowledge base of key component suppliers. BSEE w ith EE experience . Experience in Agile or