Principal Product Engineer - Memory IP
Cadence Design Systems
- Location
- Nanjing
- Work model
- On-Site
- Level
- Principal
- H-1B history
- 77 approvals (FY2023)
- Posted
- Aug 18, 2026
About this role
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Primary Responsibilities: ○ Supporting pre-silicon integration, usage, and implementation of memory subsystem products ○ Helping with internal system integration and QA testing of memory subsystem products (Controller + PHY) Analyzing and resolving complex subsystem application or implementation issues and providing professional guidance to customers ○ Supporting various memory PHY and controller SOC integration reviews and implementation reviews ○ Assisting customers with RTL and gate-level simulations to verify functionality ○ Assisting customers with timing closure and other aspects of physical integration Participating in development and refinement of product documentation and checklists for customer applications ○ Supporting post-silicon bringup and production test activities for customers as needed Enhancing customer experience by providing prompt, thorough, and technically accurate responses to customer questions ○ Leveraging AI-powered tools and assistants to enhance productivity, improve decision making, and maintain high-quality customer deliverables. ○Applying AI-powered analytics tools to extract insights, identify patterns, and generate actionable recommendations from complex datasets Position Requirements: ○ B.S Electrical/Computer Engineering (or similar degree) and 7+ years of overall experience -OR- M.S Electrical/Computer Engineering (or similar degree) and 5+ years of overall experience ○ Experience working with DDR5/4/3, LPDDR5/4/3, HBM3, GDDR6 or similar IPs ○ Verilog RTL design and gate level verification experience ○ Synthesis and static timing analysis experience (physical implementation/verification experience is a plus) ○ Familiarity with industry standard DFT flows and test methodologies. ○ Familiarity with package and board design ○ Ability to read schematics and participate in SI/PI reviews for customer board/package implementation Preferred Qualifications ○ Experience with Memory PHY and DSP based architecture ○ Experience with embedded microcontroller FW ○ Background with scripting and applying AI solutions to daily workflows We’re doing work that matters. Help us solve what others can’t.