Signal Integrity Lead

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Systems Engineering General Summary: The Qualcomm Data Center team is developing high-performance, energy-efficient server solutions for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work.

We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you'll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm's Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more.

Signal Integrity Lead   We are seeking a Signal Integrity Lead to provide technical and people leadership across Qualcomm's data center server platforms. In this role, you will lead and grow a team of signal integrity engineers while collaborating closely with platform, silicon, packaging, firmware, and component engineering teams.   You will be responsible for establishing SI methodology , validation strategy, design guidelines, and product-level signoff criteria across memory and SerDes interfaces, package-to-board integration, PCBs, cables, and system interconnects. The role requires close collaboration with silicon and package design organizations to assess die/package SI solutions and ensure successful integration into Qualcomm server products.

Lead, develop, and grow the Signal Integrity team, including hiring, coaching, career development, performance management, and resource planning across multiple programs.   Define signal integrity strategy, methodology, and best practices across Qualcomm data center products.   Collaborate with SoC, applications engineering, packaging, and system design teams to develop system interconnect solutions that meet performance, reliability, and scalability requirements.   Collaborate with silicon and package design teams to review and validate die/package signal integrity solutions and approve their integration into the final server product.   Provide guidance and feedback on silicon timing, bump/RDL implementation, package pinout, PCB specifications, connector selection , and channel architecture.   Establish design rules, signoff criteria, correlation plans, and validation processes for high-speed interfaces.   Develop customer guidelines and define model formats and interfaces for simulation and system integration.   Lead the development of SI models, simulation frameworks , and analysis flows across memory and high-speed serial interfaces.   Assess early SI analysis of advanced packaging technologies, including 2.5D and 3D integration structures, and establish system-level integration guidelines.   Drive system-level SI architecture spanning package-to-board interfaces, PCB, connectors, cables, chassis, and future rack-level interconnects.   Update and automate design and analysis flows to improve productivity, accuracy, and scalability.   Partner with cross-functional teams to resolve complex SI issues and drive technical decision - making throughout product development.   Prepare and present technical documentation, design reviews, and recommendations to engineering teams, senior leadership, customers, and suppliers.

Master's degree in Electrical Engineering , Computer Engineering, or a related field.   10 + years of experience in signal integrity analysis, simulation, and validation of high-speed digital systems.   Experience managing a signal integrity engineering team.    Strong knowledge of SI fundamentals, including transmission line theory, channel analysis, crosstalk, S-parameters, jitter analysis, and system-level performance